Zobrazeno 1 - 10
of 54
pro vyhledávání: '"J.F. Michaud"'
Autor:
Fabrice Letertre, Benedite Osternaud, Nicolas Daval, Ian Cayrefourcq, C. Lagahe, B. Bataillou, C. Aulentte, C. Morales, N. Sousbie, S. Sartori, Carlos Mazure, Franck Fournel, Beatrice Biasse, E. Jalaguier, B. Aspar, J.F. Michaud, C. Richtarch, Bruno Ghyselen, A.M. Cartier, Takeshi Akatsu, S. Pocas, Olivier Rayssac, A. Beaumont, A. Soubie, Hubert Moriceau
Publikováno v:
Journal of Electronic Materials. 32:829-835
The SmartCut process was first developed to obtain silicon-on-insulator (SOI) materials. Now an industrial process, the main Unibond SOI-structure trends are reported in this paper. Many material combinations can be achieved by this process, because
Autor:
A. Saboundji, J.F. Michaud, T. Mohammed-Brahim, F. Le Bihan, G. Andrä, J. Bergmann, Fritz Falk
Publikováno v:
Solid State Phenomena. 93:55-60
Autor:
C. Pudda, F. Gusella, Beatrice Biasse, C. Jaussaud, J. Margail, J.F. Michaud, A. Soubie, J. M. Lamure
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 55:826-830
Based on the results of five years of research on the SIMOX process, a complete facility for production of SIMOX wafers on a semi-industrial basis has been set up at LETI. This facility which is located in a class-100 clean room comprises an BATON NV
Publikováno v:
Conference Proceedings. Eleventh International Conference on Indium Phosphide and Related Materials (IPRM'99) (Cat. No.99CH36362).
We describe a new technique which allows a large dimension III-V thin film to be transferred on a full silicon wafer. The potential applications of this technology to InP are: spatial solar cells and integration of optic functions on silicon. This or
Autor:
B. Biasse, A.M. Cartier, A.M. Papon, F. Gusella, J.F. Michaud, J. Margail, C. Jaussaud, C. Pudda, J.M. Lamure, A. Soubie
Publikováno v:
1990 IEEE SOS/SOI Technology Conference. Proceedings.
A 150 m/sup 2/ class 100 clean room, specially dedicated for separation by implantation of oxygen (SIMOX) wafer production on a semi-industrial basis, has been set up at LETI. This facility includes a very high current oxygen ion implantation machine
Akademický článek
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Autor:
B. Aspar, C. Locatelli, S. Pocas, J.F. Michaud, M. Bruel, A. Mas, E. Jalaguier, O. Rayssac, A.M. Papon, H. Moriceau
Publikováno v:
Electronics Letters. 35:1024
The ability to obtain thin films using the Smart-Cut(R) process combined with metallic bonding is demonstrated. New structures have been realised from thin films of Si, GaAs or InP bonded to silicon substrates via metallic layers.
Publikováno v:
Electronics Letters. 34:408
For the first time, transfer of a thin monocrystalline GaAs film from its original bulk substrate onto a silicon substrate was achieved by proton implantation and wafer bonding. Successful transfers of 3 in GaAs film are presented.
Akademický článek
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Publikováno v:
MRS Proceedings. 45
Outgassing of HUNT HPR 204 photoresist during ion implantation has been characterized by means of quadrupole mass analysis. The influence of the various parameters (implantation eneray, beam current, ion species) has been studied in order to point ou