Zobrazeno 1 - 10
of 56
pro vyhledávání: '"J.F. Donlon"'
Publikováno v:
IEEE Transactions on Industry Applications. 38:168-174
Insulated gate bipolar transistors (IGBTs) based on the non-punch-through (NPT) design approach exhibit excellent safe operating area (SOA) and short-circuit endurance, a positive temperature coefficient of on-state voltage over the operating current
Publikováno v:
IEEE Transactions on Industry Applications. 37:896-903
Publikováno v:
2013 IEEE Energy Conversion Congress and Exposition.
A resistance-capacitance $(RC) $ thermal network with temperature-dependent thermal conductivities and heat capacitances is used to calculate the junction temperature of insulated-gate bipolar-transistor modules using a device model realized in Simul
Publikováno v:
IEEE Transactions on Industry Applications. 27:507-514
The authors discuss the turn-on and turn-off losses in a gate turn-off (GTO) thyristor which must be properly accounted for because they can comprise upwards of 60% of the total losses. The authors attempt to discuss and clarify the definitions of po
Publikováno v:
IAS
Since the introduction of the IGBT module, improvements in power loss have been achieved by applying new technologies. With the process improvements of the past few years in trench gate technology and light-punch-through vertical structures, it had b
Publikováno v:
IAS
High voltage IGBT (HVIGBT) modules with high performance in the areas of low power loss and high reliability are required for high power applications such as traction, large industrial motor drives, and medium voltage converters. Unfortunately, these
Publikováno v:
2007 European Conference on Power Electronics and Applications.
High voltage IGBT (HVIGBT) modules with high performance in the areas of low power loss and high reliability are required for high power applications such as traction, large industrial motor drives, and medium voltage converters. Unfortunately, these
Publikováno v:
Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting.
Intelligent power modules (IPMs) in the 600V class have been successfully applied to a variety of industrial and consumer applications for upwards of ten years. Transfer mold manufacturing technology was adopted about eight years ago to reduce cost a
Autor:
E.R. Motto, J.F. Donlon
Publikováno v:
Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, 2006. APEC '06..
This paper describes a new family of intelligent power modules utilizing a novel gate driver that automatically adjusts its driving speed as a function of collector current to provide an improved trade-off between switching losses and switching noise
Publikováno v:
Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting..
This paper describes the characteristics of a new 1200 V, 100 A reverse blocking IGBT chip. It will be shown that this new chip exhibits symmetrical off-state blocking voltage and low losses making it a promising candidate for power conversion topolo