Zobrazeno 1 - 10
of 25
pro vyhledávání: '"J.D. Morsey"'
Publikováno v:
IEEE Transactions on Antennas and Propagation. 57:3136-3146
A powerful technique for solving electromagnetic (EM) surface integral equations (SIEs) for inhomogenous objects by the method of moments (MoM) involves the well-known Rao-Wilton-Glisson (RWG) basis function to represent the electric current and, for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::307d8aea6ffb39fb9269a57bd95a70ab
https://doi.org/10.1109/tap.2009.2028622
https://doi.org/10.1109/tap.2009.2028622
Autor:
J.D. Morsey, L. Eisenberg, Barry J. Rubin, Alina Deutsch, C.W. Surovic, Li Jun Jiang, J.P. Libous
Publikováno v:
IEEE Transactions on Advanced Packaging. 30:288-294
Presented here are results and recommendations for reducing coupling between adjacent power islands based on full-wave simulations of a HyperBGA SCM (single-chip module). These simulations highlight the use of IBM's internally developed accelerated f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e8e4b3616848de4de3062bd05a3acb10
https://doi.org/10.1109/tadvp.2007.896005
https://doi.org/10.1109/tadvp.2007.896005
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
High data switching rates of today's computer architecture continue to intensify the need for transmission line modeling accuracy. As these data rates exceed hundreds of megahertz and the physical complexity of the transmission channel increase, it m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::414ac7a133e047fa2277d4c999af1d7f
https://doi.org/10.1109/ectc.2011.5898556
https://doi.org/10.1109/ectc.2011.5898556
Publikováno v:
19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.
Accurate channel simulations of package interconnections require passive and causal models that faithfully represent the full frequency response from tens of gigahertz to DC. In this paper, we propose and test a method to create accurate models exten
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::58f98dd4563108816449ec8baf4210fa
https://doi.org/10.1109/epeps.2010.5642594
https://doi.org/10.1109/epeps.2010.5642594
Publikováno v:
2008 IEEE-EPEP Electrical Performance of Electronic Packaging.
This paper presents the concept of using a virtual test bench to emulate measurements via simulation and modeling. For demonstration purposes, this idea is used to quantify the measurement sensitivity of the short-pulse propagation technique to the l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7510c3d6482caa94720c4dda7500da1a
https://doi.org/10.1109/epep.2008.4675917
https://doi.org/10.1109/epep.2008.4675917
Autor:
Dale Becker, Li Jun Jiang, J.D. Morsey, Barry J. Rubin, Anand Haridass, Alina Deutsch, C.W. Surovic
Publikováno v:
2008 58th Electronic Components and Technology Conference.
A parallel, distributed memory version of a full wave method of moments (MoM) solution combined with the reduced coupling approximation technique is presented on the largest parallel-server. Modeling results for product-level simulation of a single-c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba3529e11612d392112180179c9c2a65
https://doi.org/10.1109/ectc.2008.4550130
https://doi.org/10.1109/ectc.2008.4550130
Publikováno v:
2007 IEEE Electrical Performance of Electronic Packaging.
The paper contains a novel mechanism for full wave electromagnetic simulation of complicated inhomogeneous structures, such as on-chip interconnects, IC packaging, antennas, and scattering objects. It uses only equivalent principle based EFIE instead
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::332ff2e870638e5b27137674d5f3cd98
https://doi.org/10.1109/epep.2007.4387202
https://doi.org/10.1109/epep.2007.4387202
Publikováno v:
2007 IEEE Electrical Performance of Electronic Packaging.
A parallel LU decomposition algorithm is presented to take advantage of the sparse impedance matrix produced by the reduced-coupling method. This algorithm allows rapid simulation of very large chip and packaging problems. A representative example is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b2d248a52a813214b932c9aaa5a7e408
https://doi.org/10.1109/epep.2007.4387196
https://doi.org/10.1109/epep.2007.4387196
Publikováno v:
2006 IEEE Electrical Performane of Electronic Packaging.
In this paper, a novel hierarchical capacitance extraction method is introduced. It takes advantage of surface integral equations to have far less unknowns than the volumetric method. It uses the "divide and conquer" strategy to hierarchically solve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96f52883003b9df229810e3d315cc75d
https://doi.org/10.1109/epep.2006.321245
https://doi.org/10.1109/epep.2006.321245
Autor:
L. Shan, J.D. Morsey, Barry J. Rubin, K.B. Eisenberg, Dale Becker, M. Arseneault, Li Jun Jiang
Publikováno v:
2006 IEEE Electrical Performane of Electronic Packaging.
Fast integral equation methods are now being applied to packaging and other such " low frequency" problems. This paper explores some of the issues surrounding such an application to real, product level packaging and interconnect type structures. Disc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::062665dc84043604aeea998dc39efa8a
https://doi.org/10.1109/epep.2006.321246
https://doi.org/10.1109/epep.2006.321246