Zobrazeno 1 - 10
of 441
pro vyhledávání: '"J.A. Appel"'
Autor:
C. R. Newsom, H.P. Cease, Jing Wang, R. Coluccia, Simon Kwan, R.J. Yarema, V. Papavassiliou, J. Hoff, Dario Menasce, G. Cardoso, Marina Artuso, S. Magni, A. Schreiner, A. Mekkaoui, J.A. Appel, M. Turqueti, D.A. Cinabro, Lorenzo Uplegger, G. Chiodini, D. C. Christian
Publikováno v:
IEEE Transactions on Nuclear Science. 53:409-413
High energy and nuclear physics experiments need tracking devices with increasing spatial precision and readout speed in the face of ever-higher track densities and increased radiation environments. The new generation of hybrid pixel detectors (array
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15a83c9083da03ec322c48ed8759e30b
https://doi.org/10.1109/tns.2006.869851
https://doi.org/10.1109/tns.2006.869851
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment. 549:165-170
A radiation tolerant pixel readout chip, FPIX2, has been developed at Fermilab for use by BTeV. Some of the requirements of the BTeV pixel readout chip are reviewed and contrasted with requirements for similar devices in LHC experiments. A descriptio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a9aff135c332dcd4cd9e2373129b680
https://doi.org/10.1016/j.nima.2005.04.046
https://doi.org/10.1016/j.nima.2005.04.046
Autor:
G. Cardoso, J. Andresen, J.A. Appel, D.C. Christian, B.K. Hall, S.W. Kwan, M.A. Turqueti, S. Zimmermann
Publikováno v:
IEEE Transactions on Nuclear Science. 51:2168-2173
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::163c093cdf6d323a0c86e9035443347d
https://doi.org/10.1109/tns.2004.836059
https://doi.org/10.1109/tns.2004.836059
Autor:
B.K. Hall, S. Cihangir, S. Zimmermann, M. Turqueti, G. Cardoso, Simon Kwan, J.A. Appel, D. C. Christian
Publikováno v:
IEEE Transactions on Nuclear Science. 51:2161-2167
The pixel detector proposed for the BTeV experiment at the Fermilab Tevatron will use bump-bonding technology based on either Indium or Pb/Sn solder to connect the front-end readout chips to the silicon pixel sensors. We have studied the behavior of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3c18791ec6c4f19c6c2fa77d3523ef45
https://doi.org/10.1109/tns.2004.834709
https://doi.org/10.1109/tns.2004.834709
Autor:
G. Sellberg, Simon Kwan, G. Chiodini, M.R. Coluccia, J.A. Appel, S. Cihangir, D. C. Christian
Publikováno v:
Scopus-Elsevier
The pixel detector in the BTeV experiment at the Tevatron (Fermilab) provides high-resolution tracking and vertex identification. For this task, the hybrid pixel detector has to work in a very harsh radiation environment with 10/sup 14/ minimum ioniz
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::646978f39bd07356486ab386c4d7476c
https://doi.org/10.1109/tns.2003.815315
https://doi.org/10.1109/tns.2003.815315
Autor:
G. Sellberg, M.R. Coluccia, D. C. Christian, Simon Kwan, J.A. Appel, Lorenzo Uplegger, G. Chiodini
Publikováno v:
IEEE Transactions on Nuclear Science. 49:2914-2918
We present IV and CV curves for irradiated prototype n/sup +//n/p/sup +/ silicon pixel sensors, intended for use in the BTeV experiment at Fermilab. We tested pixel sensors from various vendors and with two pixel isolation techniques: p-stop and p-sp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::defafa567f78662ad00f0d825726cb8f
https://doi.org/10.1109/tns.2002.805419
https://doi.org/10.1109/tns.2002.805419
Autor:
G. Cardoso, B.K. Hall, R.J. Yarema, D. C. Christian, S. Zimmermann, Simon Kwan, J.A. Appel, J. Hoff, A. Mekkaoui
Publikováno v:
IEEE Transactions on Nuclear Science. 49:1185-1189
The pixel detector for the BTeV experiment at Fermilab provides digitized data from approximately 22 million silicon pixel channels. Portions of the detector are six millimeters from the beam providing a substantial hit rate and high radiation dose.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::264f0bf291037cec51d417d513204bab
https://doi.org/10.1109/tns.2002.1039634
https://doi.org/10.1109/tns.2002.1039634
Autor:
B.K. Hall, R.J. Yarema, Simon Kwan, J. Andresen, G. Chiodini, A. Mekkaoui, G. Cardoso, J.A. Appel, S. Zimmermann, S. Cihangir, J. Hoff, D. C. Christian
Publikováno v:
IEEE Transactions on Advanced Packaging. 25:36-42
At Fermilab, both pixel detector multichip module and sensor hybridization are being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The backs of the ICs
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f7c00993f566a58b53adbd221f08c06
https://doi.org/10.1109/tadvp.2002.1017683
https://doi.org/10.1109/tadvp.2002.1017683
Autor:
S. Zimmermann, Gustavo Cancelo, W. C. Wester, R.J. Yarema, D. C. Christian, J.A. Appel, J. Hoff, A. Mekkaoui, Simon Kwan
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment. 473:152-156
A radiation-hard pixel readout chip, FPIX2, is being developed at Fermilab for the recently approved BTeV experiment. Although designed for BTeV, this chip should also be appropriate for use by CDF and DZero. A short review of this development effort
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2344664a3d76bc4fa7b54290b4249763
https://doi.org/10.1016/s0168-9002(01)01137-8
https://doi.org/10.1016/s0168-9002(01)01137-8
Autor:
R.J. Yarema, S. Cihangir, A. Vargas, Simon Kwan, S. Zimmermann, A. Mekkaoui, J. Hoff, J.A. Appel, P. A. Kasper, G. Cardoso, D. C. Christian, G. Cancelo, R.W. Downing
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment. 465:224-228
This paper describes the baseline design and a variation of the pixel module to handle the data rate required for the BTeV experiment at Fermilab. The present prototype has shown good electrical performance characteristics. Indium bump bonding is pro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e982becbfe19a7d6027ecd50cc5e0cd
https://doi.org/10.1016/s0168-9002(01)00394-1
https://doi.org/10.1016/s0168-9002(01)00394-1