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Autor:
J. Barrett, S.C. O'Mathuna, Orla Slattery, I. Serthelon, M. Masgrangeas, C. Val, C. Cahill, J. O'Donovan, A. Coello-Vera, P. Ivey, J. Stern, J.-P. Tigners, A. Compagno
Publikováno v:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A. 18:765-772
This paper describes the thermal characterization of a vertical multichip module (MCM-V) technology. The MCM-V technology encloses a stack of IC's in a three dimensional cube of plastic molding compound, with the inter-chip electrical connections mad
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b3e2e64dd43d176ae6484352367172a7
https://doi.org/10.1109/95.477462
https://doi.org/10.1109/95.477462
