Zobrazeno 1 - 7
of 7
pro vyhledávání: '"J.-P. Ramy"'
Publikováno v:
Active and Passive Electronic Components, Vol 10, Iss 2-3, Pp 157-162 (1983)
Externí odkaz:
https://doaj.org/article/44585c1629a4464783ecd3bc68c237d2
Autor:
M.H. Gibson, Robert E. Horn, Anand Gopinath, P.J. Meier, S.G. Pintzos, D.J. Coleman, Harold Jacobs, J.P. Bolloch, J.A. Paul, S.D. Shamasundara, S. Shindo, C.D. Gupta, Z. Paunovic, Tatsuo Itoh, E. Freibergs, M.-T. Cotte, S. Pavlin, A. Presser, W.R. Wisseman, Y. Konishi, Jr. Yu-Wen Chang, C. Thebault, S. Kamihashi, I. Thomson, Hua Quen Tserng, T. Takada, B.M. Neale, K.L. Klohn, R. Schnitzler, D.W. Shaw, Reinhold Pregla, J.-J. Guena, J.-P. Ramy, T.E. Rozzi, Martin Victor Schneider, T. Itanami, Y. Tajima, T.F. McMaster, F.H. Doerbeck, K. Solbach, R.H. Knerr, Darko Kajfez, M. Hirayama, A.S. Hebert, K.C. Gupta, E.R. Carlson
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 26:836-842
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e45c42239d5f64d83699f7389ef08f8
https://doi.org/10.1109/tmtt.1978.1129496
https://doi.org/10.1109/tmtt.1978.1129496
Publikováno v:
ElectroComponent Science and Technology. 10:157-162
In a previous paper,1we showed, with a microwave quality factor (Q) measurement, that in the X band and with alumina substrates, thick film losses are not worse than thin film losses when the inks are screened then etched, and when they have copper o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4165fc507ce6f72df577458799a17661
https://doi.org/10.1155/apec.10.157
https://doi.org/10.1155/apec.10.157
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 26:814-820
Two technologies can be used in the fabrication of microwave integrated circuits (MIC's), thick film and thin film. This paper describes and compares these technologies. Two types of substrates commonly used in MIC's are tested, alumina (AL/sub 2/O/s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e668eddc8b64e417be53d927ab74c5b
https://doi.org/10.1109/tmtt.1978.1129492
https://doi.org/10.1109/tmtt.1978.1129492
Publikováno v:
Microelectronics International. 2:57-59
Because of its lower dielectric constant and loss tangent, and its greater surface smoothness, fused silica is very suitable for use in the KU band and above, but its cost is very high. The purpose of this paper is therefore to select a new substrate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::238b8de869e5e432e19c3d541d903f34
https://doi.org/10.1108/eb044160
https://doi.org/10.1108/eb044160
Autor:
J.-P. Ramy, L. Demeure
Publikováno v:
Microelectronics International. 2:17-18
The bonding of laser semiconductor dice for optical telecommunication systems is very difficult because of the fragility of these new components, the necessity to bond them with very high accuracy in their location, and the necessity to have a very h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b70e0af042e48c54670eec7f23b5a701
https://doi.org/10.1108/eb044195
https://doi.org/10.1108/eb044195
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