Zobrazeno 1 - 10
of 238
pro vyhledávání: '"J.-F. Bresse"'
Autor:
Don Elthon
Publikováno v:
Journal of the American Chemical Society. 120:613-614
Autor:
D. Benoit
Publikováno v:
Scanning. 10:163-163
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 17:1174-1181
Etching of InGaAs and InP in inductively coupled plasma (ICP) using SiCl4 was studied for heterojunction bipolar transistor (HBT) applications. Low sample temperature was used to minimize etching isotropy and to reduce group V element desorption. The
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 15:626-632
We report on the sidewall and surface characterization of InP etched patterns obtained by inductively coupled plasma (ICP). The fabrication of InP based optoelectronic integrated circuits requires dry etching processes, normally using CH4/H2 gas mixt
Autor:
J.-F. Bresse
Publikováno v:
Materials Science and Engineering: B. 42:199-203
Starting from an analytical expression of the energy loss as a function of the depth, a complete analytical calculation has been done for the cathodoluminescence (CL) intensity in GaAs and InP materials. For the case of a bulk substrate, the analytic
Autor:
J.-F. Bresse
Publikováno v:
Materials Science and Engineering: B. 24:229-232
This paper gives guidelines to help those who want to characterize a semiconductor sample or device. A short overview of the existing beam injection techniques is presented. Orders of magnitude of spatial resolution and sensitivity are given for each
Autor:
J.-F. Bresse
Publikováno v:
Scanning. 12:308-314
We present here examples of applications of SEAM for the characterization of III-V compound semiconductors and the visualisation of defects in devices. The electron acoustic signal can be quantitatively correlated to the total incorporation of impuri
Publikováno v:
Journal of The Electrochemical Society. 137:1514-1519
A study of the properties of As-doped and undoped GeMoW contacts prepared by different annealing techniques leads to the optimization of a new refractory ohmic contact consisting of an As-doped Ge-layer deposited by electron beam evaporation and sput
Publikováno v:
Journal of The Electrochemical Society. 137:671-675
Publikováno v:
Applied Physics Letters. 58:2773-2775
W/Ni0.9‐In0.1 refractory ohmic contacts presenting low specific resistivity have been formed on n‐type GaAs by magnetron cathodic sputtering and subsequently annealed by rapid thermal processing at 850 °C for 10 s. The increase of Ni‐In film t