Zobrazeno 1 - 10
of 32
pro vyhledávání: '"J.-C. Lecomte"'
Autor:
C. Journe, J.-C. Lecomte, Olivier Monneuse, J. Avondo, Vivien Thomson, P.-F. Chaillot, A. Ben Cheikh, G. Gorincour, Emile Youssof
Publikováno v:
Journal de Chirurgie Viscérale. 158:S28-S33
Resume Les termes d’intelligence artificielle (IA) et de « telemedecine » sont aujourd’hui utilises dans tous les champs de la medecine, avec des degres de pertinence qui semblent variables. Si la telemedecine correspond a l’evolution actuell
Autor:
P.-F. Chaillot, Vivien Thomson, O. Monneuse, C. Journe, J.-C. Lecomte, J. Avondo, G. Gorincour, A. Ben Cheikh, Emile Youssof
Publikováno v:
Journal of visceral surgery. 158(3S)
The terms "telemedicine" and "artificial intelligence" (AI) are used today throughout all fields of medicine, with varying degrees of relevance. If telemedicine corresponds to practices currently being developed to supply a high quality response to m
Publikováno v:
Scopus-Elsevier
Objectives/Scope The inherent complexity of unconventional resources, within the ever growing economic development of these, gave rise to many work-flows, in which both natural and hydraulic fractures are accounted for through the use of DFN (Discret
Autor:
J. C. Lecomte, M. Haschke
Publikováno v:
Journal de Physique IV (Proceedings). 118:213-219
New technologies in microelectronics require the non-destructive analysis of very thin coatings down to the nm-range. X-Ray fluorescent spectroscopy is used already for a long time for coating thickness testing. But typical thickness was in the μm-R
Akademický článek
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Publikováno v:
Diagnostic and interventional imaging. 93(11)
Publikováno v:
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
Topography and deformation measurements (T.D.M.) under thermomechanical solicitation is a new approach for localising and quantifying deformation of electronic assemblies. Cooling and heating capabilities, with different temperature rate and maximum,
Akademický článek
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Autor:
J.-C. Lecomte, R. Fayolle
Publikováno v:
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
Increases in interconnection level and power density lead to growing reliability problems in microelectronic packages. Assembly processes, materials selection and package design have to be continuously re-arranged. Nondestructive, volume imaging tech
Autor:
J. Letouzey, J. C. Lecomte, F. Gaumet, R. Tenreyro, J. G. Lopez, S. Zimine, J. O. Lopez, E. Linares, I.C. Moretti, C. Magnier
In order to quantify the petroleum potential of the northwest offshore zone of Cuba, the source-rock potential has been estimated as well as the maturation level and the possible migration pathways. An interpretation of new seismic lines acquired by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db8980558923b6e6332445ed42e059cd
https://doi.org/10.1306/m79877c31
https://doi.org/10.1306/m79877c31