Zobrazeno 1 - 2
of 2
pro vyhledávání: '"J. W. C. DeVries"'
Publikováno v:
Microelectronics Reliability. 52:2763-2772
This study focuses on quasi-static mechanical cycling durability of copper traces on printed wiring assemblies (PWAs). PWA specimens populated with Land Grid Array (LGA) components on copper-defined pads were cycled to failure under zero-to-max, thre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::960038d4233cf4aafb6a27f520af5fc1
https://doi.org/10.1016/j.microrel.2012.06.114
https://doi.org/10.1016/j.microrel.2012.06.114
Autor:
J.F.J.M. Caers, Moustafa Al-Bassyiouni, Y. Zhou, Abhijit Dasgupta, D. Farley, F. Askari, J. W. C. DeVries
Publikováno v:
Microelectronics Reliability. 50:937-947
When assessing the mechanical durability of electronic assemblies, the focus is generally on the solder interconnects. However, in many package styles, such as ball grid arrays (BGAs), land grid arrays (LGAs), micro lead frame (MLFs) and quad flat no
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6e9ec94feae4d2fb04756a4ad29f47b0
https://doi.org/10.1016/j.microrel.2010.03.004
https://doi.org/10.1016/j.microrel.2010.03.004