Zobrazeno 1 - 10
of 14
pro vyhledávání: '"J. W. C. DeVries"'
Publikováno v:
Microelectronics Reliability. 52:2763-2772
This study focuses on quasi-static mechanical cycling durability of copper traces on printed wiring assemblies (PWAs). PWA specimens populated with Land Grid Array (LGA) components on copper-defined pads were cycled to failure under zero-to-max, thre
Autor:
J.F.J.M. Caers, Moustafa Al-Bassyiouni, Y. Zhou, Abhijit Dasgupta, D. Farley, F. Askari, J. W. C. DeVries
Publikováno v:
Microelectronics Reliability. 50:937-947
When assessing the mechanical durability of electronic assemblies, the focus is generally on the solder interconnects. However, in many package styles, such as ball grid arrays (BGAs), land grid arrays (LGAs), micro lead frame (MLFs) and quad flat no
Publikováno v:
Journal of Applied Polymer Science; 7/20/2022, Vol. 139 Issue 28, p1-24, 24p
Publikováno v:
Journal of Applied Physics; Mar2011, Vol. 109 Issue 5, p054109, 9p, 10 Graphs
Publikováno v:
Journal of the American Ceramic Society. Jul2008, Vol. 91 Issue 7, p2182-2188. 7p. 1 Black and White Photograph, 2 Charts, 11 Graphs.
Autor:
Hosseini, Maryamsadat, Koike, Junichi, Sutou, Yuji, Zhao, Larry, Lai, Steven, Arghavani, Reza
Publikováno v:
2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC); 2016, p162-164, 3p
Publikováno v:
Journal of the American Ceramic Society; Jul2008, Vol. 91 Issue 7, p2182-2188, 7p, 1 Black and White Photograph, 2 Charts, 11 Graphs
Autor:
Zhang, Zhi-Fan, Kennish, Richard A., Youngdahl, Blohowiak Kay A., Hoppe, Martin L., Laine, Richard M.
Publikováno v:
Journal of Materials Research; 08/01/1993, Vol. 8 Issue 8, p1777-1790, 14p
Autor:
Weaver, B.D., Jackson, E.M., Summers, G.P., Chrisey, D.B., Horwitz, J.S., Pond, J.M., Newman, H.S., Burke, E.A.
Publikováno v:
IEEE Transactions on Nuclear Science; 1991, Vol. 38 Issue 6, p1284-1288, 5p
Publikováno v:
Review of Scientific Instruments; Sep96, Vol. 67 Issue 9, p3187, 6p, 4 Diagrams, 11 Graphs