Zobrazeno 1 - 10
of 37
pro vyhledávání: '"J. Seyyedi"'
Autor:
J. Seyyedi, J. Padgett
Publikováno v:
Soldering & Surface Mount Technology. 13:7-11
As part of a programme of characterisation of interconnection technologies for computer server products the present investigation was conducted to determine the attachment integrity and long‐term reliability of resistor network ceramic Chip Scale P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c586fe2538b9928e6f6eedc326ec8fbd
https://doi.org/10.1108/09540910110407351
https://doi.org/10.1108/09540910110407351
Publikováno v:
Soldering & Surface Mount Technology. 8:29-32
As part of the portable product interconnects characterisation programme, the present investigation was conducted to determine the attachment integrity and long‐term reliability of Thin small Outline package (TSOP) solder joints. Accelerated therma
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::600cc316fa3b8a102cfeb61f00bafbdb
https://doi.org/10.1108/09540919610777663
https://doi.org/10.1108/09540919610777663
Autor:
J. Seyyedi
Publikováno v:
Soldering & Surface Mount Technology. 6:15-20
The reliability of solder joints and plated‐through‐hole (PTH) copper structure was investigated for 503 I/O interstitial pin grid array packages with two different pin diameters. Each package type was wave soldered to printed wiring boards havin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::233462912633e28d36f9b64432e20f4a
https://doi.org/10.1108/eb037875
https://doi.org/10.1108/eb037875
Autor:
J. Seyyedi
Publikováno v:
Soldering & Surface Mount Technology. 5:26-32
An empirical study was conducted to determine the thermal fatigue behaviour of 1.27 mm pitch, J‐bend and gullwing surface mount solder joints, manufactured with four low‐temperature solders. Selected solder alloys were: 58Bi‐42Sn (wt %), 43Sn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3954e1a8ba1a505460a03ccaa8bc19e6
https://doi.org/10.1108/eb037812
https://doi.org/10.1108/eb037812
Autor:
J. Seyyedi, J. Sauber
Publikováno v:
Journal of Electronic Packaging. 114:472-476
A power-law type creep equation has been added to finite element models to calculate solder joint response to time, temperature, and stress level. The ability of the models to predict solder joint behavior was verified by running a series of creep te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a3143741f0aeedab54af309a62db1ac1
https://doi.org/10.1115/1.2905484
https://doi.org/10.1115/1.2905484
Publikováno v:
Soldering & Surface Mount Technology. 3:49-53
Quasi shear and tensile mode stress‐rupture and quasi shear mode creep behaviours were investigated for aged production surface mount soldered connections of 127 mm pitch, rigid gullwing and J‐bend configurations at ambient and 60°C (on limited
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1178e0800146c25d4fc7b79d935554c3
https://doi.org/10.1108/eb037743
https://doi.org/10.1108/eb037743
Autor:
J. Seyyedi, S. Jawaid
Publikováno v:
Soldering & Surface Mount Technology. 2:44-49
The wearout characteristics were investigated for soldered interconnections of surface mount technology (SMT) chip resistors, chip capacitors and a 44 I/O ceramic leaded chip carrier (CLCC) package. Four double‐sided test vehicles were subjected to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::566d5352b851d186e284423395619d9f
https://doi.org/10.1108/eb037706
https://doi.org/10.1108/eb037706
Publikováno v:
MRS Proceedings. 203
The lifetime of non-compliant eutectic solder joints was improved by an order magnitude by rapid quenching. The quenching produces a fine equiaxed superplastic grain structure which lowers the stresses in the solder joints for the fatigue cycle strai
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e57ba4ce62ea138bb73f91537775db5
https://doi.org/10.1557/proc-203-425
https://doi.org/10.1557/proc-203-425
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
Hamid Nayeb-Hashemi, J. Seyyedi
Publikováno v:
Metallurgical Transactions A. 20:727-739
The formation of fiber-matrix interfacial reaction zone and its impact on mechanical properties of Gr/201 Al composite (41 vol pct fiber) was evaluated in the as-received condition and after heat treatment in vacuum at 450°C, 500°C, and 545°C temp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93b08b6765525a15521ff5d1dca24983
https://doi.org/10.1007/bf02667590
https://doi.org/10.1007/bf02667590