Zobrazeno 1 - 4
of 4
pro vyhledávání: '"J. O. Borland"'
Autor:
Eric Chason, O. W. Holland, J. M. Poate, James W. Mayer, Michael I. Current, Charles W. Magee, S. T. Picraux, Al F. Tasch, John Melngailis, Mark E. Law, T. Diaz de la Rubia, J. O. Borland, D. J. Eaglesham
Publikováno v:
Journal of Applied Physics. 81:6513-6561
General trends in integrated circuit technology toward smaller device dimensions, lower thermal budgets, and simplified processing steps present severe physical and engineering challenges to ion implantation. These challenges, together with the need
Autor:
K. Nummy, V. J. Silvestri, R. Bendernagel, J. Hann, V. T. Phan, D. Kerr, J. O. Borland, P. Ronsheim
Publikováno v:
Journal of The Electrochemical Society. 137:2323-2327
ULSI quality silicon epitaxial films as thin as 0.6 μm have been grown using dichlorosilane at temperatures as low as 850 o C and pressures as low as 10 torr in commercially available cylindrical epi reactors. Removal of the substrate surface native
Publikováno v:
Extended Abstracts of the 1993 International Conference on Solid State Devices and Materials.
Autor:
J. O. Borland, D. Kerr, V. J. Silvestri, K. Nummy, R. Bendernagel, J. Hann, V. T. Phan, P. Ronsheim
Publikováno v:
ChemInform. 21
ULSI quality silicon epitaxial films as thin as 0.6 μm have been grown using dichlorosilane at temperatures as low as 850 o C and pressures as low as 10 torr in commercially available cylindrical epi reactors. Removal of the substrate surface native