Zobrazeno 1 - 10
of 324
pro vyhledávání: '"J. M. Poate"'
Autor:
K. Saadatmand, J. M. Poate
Publikováno v:
Review of Scientific Instruments. 73:868-872
Ion beam technologies, in particular ion implantation, have had a profound effect on the development of Si integrated circuits. We review the pertinent history of ion source and machine development within the constraints of Moore’s law. For ion sou
Publikováno v:
Journal of Applied Physics. 86:1221-1225
The dose dependence of as-implanted damage and the density of threading dislocations formed after MeV implants into Si is measured. The role of the damage and amorphization in the evolution of dislocation microstructure is assessed. As-implanted dama
Autor:
J. M. Poate, D. C. Jacobson, D. J. Eaglesham, James Williams, Jennifer Wong-Leung, J. Sapjeta
Publikováno v:
Journal of Applied Physics. 83:580-584
We report on the precipitation kinetics of Fe contamination at Si–SiO2 interfaces during dry oxidation at 900 °C. Transmission electron microscopy (TEM) and atomic force microscopy are used to monitor the interface roughness and precipitate densit
Publikováno v:
Journal of Applied Physics. 82:583-588
We have determined the perturbance in the silicon vacancy concentration induced by the presence of TiSi2 films. Antimony in silicon doping superlattices was employed as a vacancy detector. Under all conditions studied (deposited titanium thickness 4
Publikováno v:
Journal of Applied Physics. 82:120-125
We present a quantitative study of the evolution of point defects into clusters and extended defects in ion-implanted Si. Deep level transient spectroscopy (DLTS) measurements are used to identify and count the electrically active defects in the dama
Autor:
Eric Chason, O. W. Holland, J. M. Poate, James W. Mayer, Michael I. Current, Charles W. Magee, S. T. Picraux, Al F. Tasch, John Melngailis, Mark E. Law, T. Diaz de la Rubia, J. O. Borland, D. J. Eaglesham
Publikováno v:
Journal of Applied Physics. 81:6513-6561
General trends in integrated circuit technology toward smaller device dimensions, lower thermal budgets, and simplified processing steps present severe physical and engineering challenges to ion implantation. These challenges, together with the need
Autor:
G. H. Gilmer, Dale Conrad Jacobson, H. S. Luftman, D. J. Eaglesham, Peter Stolk, T. E. Haynes, H.-J. Gossmann, Conor S. Rafferty, Martín Jaraíz, J. M. Poate
Publikováno v:
Journal of Applied Physics. 81:6031-6050
Implanted B and P dopants in Si exhibit transient enhanced diffusion (TED) during annealing which arises from the excess interstitials generated by the implant. In order to study the mechanisms of TED, transmission electron microscopy measurements of
Autor:
D. J. Eaglesham, Dale Conrad Jacobson, Aditya Agarwal, J. M. Poate, T.E. Haynes, H.-J. Gossmann
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 120:1-4
Recent results on extended defect formation after ion implantation are reviewed. Interstitial evaporation from {311} extended defects dominates transient diffusion over most of the range of temperatures, times, and dopant concentrations of technologi
Publikováno v:
Journal of Applied Physics. 80:2105-2112
The extended defects induced in silicon by high energy implantation (1.5 MeV B and 2.6 MeV P) have been investigated by plan‐view and cross‐sectional transmission electron microscopy studies and defect etching measurements. The threading dislocat
Publikováno v:
Materials Science and Engineering: B. 36:275-281
This paper presents experimental studies on the interaction between C and interstitials in crystalline Si. Boron doped Si superlattices, grown by molecular beam epitaxy, were used to detect the injection of excess Si self-interstitials (I) from near-