Zobrazeno 1 - 10
of 51
pro vyhledávání: '"J. M. E. Harper"'
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 28:838-841
The authors investigated the texture and microstructure evolution of Cu1−xAgx composite thin films through x-ray diffraction pole figures as a function of composition for x≤0.5. As codeposited at room temperature by magnetron sputtering, the fcc
Autor:
D. Deniz, J. M. E. Harper
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 27:63-66
The authors studied the development of crystallographic texture in hafnium nitride (HfN) films deposited by off-normal incidence reactive magnetron sputtering at room temperature. Films are prepared with and without added oxygen in N2∕Ar mixtures.
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 25:1214-1218
The authors report a strong dependence of fiber texture tilt angle on the gas composition in aluminum nitride (AlN) thin films prepared by off-normal reactive magnetron sputtering in N2∕Ar mixtures. Using x-ray pole figures, they measured the c-axi
Autor:
Christian Lavoie, Cyril Cabral, Jean Jordan-Sweet, F. M. d'Heurle, Andrew J. Kellock, J. M. E. Harper, Christophe Detavernier
Publikováno v:
Microelectronic Engineering. 83:2042-2054
Alloying elements can substantially affect the formation and morphological stability of nickel monosilicide. A comprehensive study of phase formation was performed on 24 Ni alloys with varying concentrations of alloying elements. Silicide films have
Publikováno v:
Journal of Materials Research. 20:3391-3396
The resistivities of as-deposited Cu(4.2Ir), Cu(2.0W), and Cu(2.2W) films are 32.2, 25.4, and 28.0 μΩcm, respectively. These resistivities are significantly higher thanthat for pure Cu films. After annealing the Cu(4.2Ir) film at constant heating r
Autor:
James R. Lloyd, Lynne Gignac, Chenming Hu, X.-H. Liu, J. M. E. Harper, R. F. Liu, A. K. Stamper
Publikováno v:
Journal of Applied Physics. 95:3737-3744
Electromigration lifetime was studied on 0.23 μm wide Cu dual-damascene lines connected to underlying W lines with a TaN/Ta liner and SiNx/SiO2 insulator. The failure criteria used to study electromigration lifetime were based on the increase in tes
Autor:
H. R. Kaufman, J. M. E. Harper
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 22:221-224
We present simple, convenient procedures for calculating ion doses for ion-assist applications such as cleaning and property modification. For many of these applications, gridless ion sources of the end-Hall type are particularly well-suited to the g
Publikováno v:
Journal of Applied Physics. 94:1605-1616
The impact of 11 alloying elements, namely, Mg, Ti, In, Sn, Al, Ag, Co, Nb, and B, at two nominal concentrations of 1 and 3 at. %, and Ir and W, at only a nominal concentration of 3 at. %, on the resistivity and grain structure of copper was investig
Publikováno v:
Journal of Applied Physics. 92:7210-7218
Texture development in (Ti,Ta)Si2, formed from Ti–Ta alloy (0–6 at. % Ta) thin films sputtered on Si(001) and poly-Si substrates, was studied using both in situ and ex situ x-ray diffraction. The addition of Ta fundamentally changes the C54 textu
Publikováno v:
Journal of Applied Physics. 92:5189-5195
The transformation from the C49 to the C54 phase in TiSi2 thin films has been studied for more than a decade because of its importance to the semiconductor industry. In previous work we identified three dominant C54 orientations in TiSi2 thin films o