Zobrazeno 1 - 10
of 15
pro vyhledávání: '"J. M. Delucca"'
Publikováno v:
Journal of Applied Physics. 88:2593-2600
Electrodeposited, dc magnetron sputtered, and electron beam evaporated Pt contacts to n-GaN (n=1.5×1017 cm−3) are reported. All contacts were rectifying in the as-deposited condition, and values of the barrier height were determined by current–v
Publikováno v:
Thin Solid Films. 371:153-160
The early stages of thermal oxidation of gallium nitride epilayers in dry O 2 have been studied using surface sensitive analytical techniques and transmission electron microscopy. Deconvolution of the Ga 3d core level spectra from X-ray photoelectron
Publikováno v:
Semiconductor Science and Technology. 14:757-761
The barrier heights of PdIn, Ni/Ga/Ni and Re Schottky contacts to n-GaN were investigated by current-voltage and capacitance-voltage measurements. Elemental Pd and Ni contacts were also investigated for comparison. In each case, the barrier heights w
Autor:
E. D. Readinger, J. M. Delucca, D. L. Waltemyer, Richard J. Molnar, Lucille A. Giannuzzi, S. D. Wolter, B. I. Prenitzer, Suzanne E. Mohney
Publikováno v:
Journal of Electronic Materials. 28:257-260
Thermal oxidation of GaN was conducted at 700–900°C with O2, N2, and Ar as carrier gases for 525–630 Torr of H2O vapor. Upon oxidation of both GaN powders and n-GaN epilayers, the monoclinic β-Ga2O3 phase was identified using glancing angle x-r
Autor:
Suzanne E. Mohney, M. J. Bozack, J. M. Delucca, Tamara Isaacs-Smith, J. Crofton, John R. Williams, E. D. Luckowski
Publikováno v:
Journal of Electronic Materials. 27:330-334
Results are reported for ohmic contacts formed on n-type 4H and 6H-SiC using nichrome (80/20 weight percent Ni/Cr). The electrical characteristics of these NiCr contacts are similar to those of contacts formed on 6H-SiC using pure Ni (∼1×10−5Ω-
Publikováno v:
Journal of Electronic Materials. 27:196-199
The annealing conditions and contact resistivities of Ta/Al ohmic contacts to n-type GaN are reported for the first time. The high temperature stability and mechanical integrity of Ti/Al and Ta/Al contacts have been investigated. Ta/Al (35 nm/115 nm)
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 16:607-610
Changes in film morphology upon annealing Ni and Ni/Au contacts to GaN were examined using scanning electron microscopy and atomic force microscopy. Atomic force microscopy was performed on the GaN surface that was exposed by etching away the metal f
Publikováno v:
Solid-State Electronics. 41:1725-1729
Very low resistance ohmic contacts to p-type SiC were fabricated by depositing a 90-10 wt.% alloy of Al and Ti followed by a high temperature anneal of approximately 1000°C for 2 min. Specific contact resistances ranged from approximately 5 × 10
Publikováno v:
Applied Physics Letters. 73:3402-3404
Electrodeposited Pt and sputtered Ni/Pt contacts to p-GaN (p=4.6×1017 cm−3) are reported and compared to sputtered Ni, Pt, and Ni/Au contacts and electron beam and thermally evaporated Ni contacts. Sequential rapid thermal annealing was employed w
Publikováno v:
Lead-Free Electronic Solders ISBN: 9780387484310
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9fd20cf93b6216d9282e520243d212ce
https://doi.org/10.1007/978-0-387-48433-4_19
https://doi.org/10.1007/978-0-387-48433-4_19