Zobrazeno 1 - 10
of 58
pro vyhledávání: '"J. Horkans"'
Autor:
J. Horkans
Publikováno v:
IBM Journal of Research and Development. 42:621-628
The electrochemical techniques typically used to monitor organic addition agents in electroplating baths work poorly in Sn-Pb solder plating baths. These electrochemical monitoring methods are based on the principle that additives act through their e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5aa08505959e015613efcf677631f8a3
https://doi.org/10.1147/rd.425.0621
https://doi.org/10.1147/rd.425.0621
Publikováno v:
IBM Journal of Research and Development. 42:567-574
Damascene Cu electroplating for on-chip metallization, which we conceived and developed in the early 1990s, has been central to IBM's Cu chip interconnection technology. We review here the challenges of filling trenches and vias with Cu without creat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4dbf147167b833121e6788d24115da1b
https://doi.org/10.1147/rd.425.0567
https://doi.org/10.1147/rd.425.0567
Autor:
Timothy J. Chainer, J. Horkans, Inna V. Babich, Lubomyr T. Romankiw, Philip L. Trouilloud, Emanuel I. Cooper, Nancy C. LaBianca, James A. Tornello, Christopher V. Jahnes, Suryanarayan G. Hegde, Keith T. Kwietniak, Sol Krongelb, Eugene J. O'Sullivan, John M. Cotte
Publikováno v:
IBM Journal of Research and Development. 42:681-694
The use of lithography and electroplating to fabricate variable-reluctance, nearly planar, integrated minimotors with 6-mm-diameter rotors on silicon wafers is described. The motors consist of six electroplated Permalloy® horseshoe-shaped cores that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af4c4c0b61f2f97d15dacdbb172f2949
https://doi.org/10.1147/rd.425.0681
https://doi.org/10.1147/rd.425.0681
Autor:
John Owen Dukovic, Ravindra Vaman Shenoy, Christopher V. Jahnes, P. C. Andricacos, Hariklia Deligianni, H.M. Tong, Madhav Datta, H Nye, Lubomyr T. Romankiw, Birenda Nath Agarwala, Jeffrey Frederick Roeder, J. Horkans, P. Totta
Publikováno v:
Journal of The Electrochemical Society. 142:3779-3785
Electrochemical fabrication of PbSn C4s (controlled collapse chip connection) offers significant cost, reliability, and environmental advantages over the currently employed evaporation technology. A continuous seed layer is required for through-mask
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e9ddd3f7d900b1f9504bead8f3f2c67
https://doi.org/10.1149/1.2048413
https://doi.org/10.1149/1.2048413
Publikováno v:
Journal of The Electrochemical Society. 140:959-965
Research was carried out in part at beamline X23A2 at the National Synchrotron Light Source, Brookhaven National Laboratory, which is supported by the U.S. Department of Energy, Division of Materials Sciences and Division of Chemical Sciences. H.S.I.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a70f7750a7388cc5233542039c016d8
https://doi.org/10.1149/1.2056235
https://doi.org/10.1149/1.2056235
Publikováno v:
IBM Journal of Research and Development. 37:97-106
A rotating ring-disk stripping technique has been used to analyze Sn-Pb alloys plated from methane sulfonic acid solutions with and without a proprietary additive and to construct associated current-potential curves. The deposition of both pure Sn an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d18cebb2414e898e53f083e87ab506d0
https://doi.org/10.1147/rd.372.0097
https://doi.org/10.1147/rd.372.0097
Publikováno v:
Journal of The Electrochemical Society. 138:411-416
An electrochemical stripping technique has been developed for the analysis of Cu alloys with iron‐group metals (particularly Ni). The alloy is plated on the disk of a rotating ring‐disk electrode. The electrode is transferred after plating to an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb7a2160d6b495d6aa8dadc87e31010b
https://doi.org/10.1149/1.2085600
https://doi.org/10.1149/1.2085600
Publikováno v:
Advances in Electrochemical Science and Engineering, Volume 1
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::20cba0ed5d8f1da5f0ad957f1c2885a6
https://doi.org/10.1002/9783527616756.ch6
https://doi.org/10.1002/9783527616756.ch6
Autor:
P. Wood, L.T. Romankiw, Z. Ling, Eugene J. O'Sullivan, J. Horkans, S. Hedge, Emanuel I. Cooper, C.K. Malek, Sol Krongelb, P. Trouilloud, K. Kwietniak, James A. Tornello, S. Roux
Publikováno v:
7th Joint MMM-Intermag Conference. Abstracts (Cat. No.98CH36275).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c084207227bc8a61c47409392b7d20a2
https://doi.org/10.1109/intmag.1998.742400
https://doi.org/10.1109/intmag.1998.742400
Autor:
Carlos J. Sambucetti, Sung K. Kang, Madhav Datta, Keith T. Kwietniak, R.A. Carruthers, Peter A. Gruber, P. C. Andricacos, J.M.E. Harper, Leathen Shi, Guy Paul Brouillette, David Danovitch, J. Horkans, John M. Cotte
Publikováno v:
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).
In addition to the environmental issue regarding the use of Pb-bearing solders in microelectronics applications, there is another issue associated with using Pb-bearing solders in interconnections, like flip chip solder interconnections in an advance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9d7ea7f2afe9d9296fc927f111865d8
https://doi.org/10.1109/ectc.1999.776186
https://doi.org/10.1109/ectc.1999.776186