Zobrazeno 1 - 3
of 3
pro vyhledávání: '"J. H-C Chen"'
Autor:
Motoyama Koichi, X. Lin, Terry A. Spooner, Praneet Adusumilli, Hosadurga Shobha, Chao-Kun Hu, Lynne Gignac, B. Peethala, Frieder H. Baumann, X. Zhang, James J. Kelly, Frank W. Mont, M. Ali, Vimal Kamineni, Shariq Siddiqui, J. H-C Chen, Huai Huang, Roger A. Quon, Y. Ostrovski, Raghuveer R. Patlolla, C. M. Breslin, G. Lian, J. Benedict, S. Smith
Publikováno v:
IRPS
Electromigration and resistivity of Cu, Co and Ru on-chip interconnections have been investigated. Non-linered Co and Ru interconnects can have better interconnect resistance than Cu, if the Cu liner cannot be scaled down below 2 nm in future interco
Autor:
G. Hornicek, X. Zhang, Frank W. Mont, Raghuveer R. Patlolla, G. Lian, Huai Huang, Chao-Kun Hu, Terry A. Spooner, Chris Breslin, R. Long, Lynne Gignac, Shariq Siddiqui, B. Peethala, Stephan A. Cohen, Terence Kane, M. Ali, Vimal Kamineni, Y. Ostrovski, James J. Kelly, Praneet Adusumilli, J. H-C Chen, John Bruley
Publikováno v:
2017 IEEE International Interconnect Technology Conference (IITC).
Electromigration and resistivity of Cu, Co and Ru on-chip interconnection have been investigated. A similar resistivity size effect increase was observed in Cu, Co, and Ru. The effect of liners and cap, e.g. Ta, Co, Ru and SiC x N y H z , on Cu/inter
Publikováno v:
Histology and histopathology. 18(3)
Endostatin, a proteolytic fragment of collagen XVIII, is a potent inhibitor of angiogenesis and suppresses neovascularization and tumor growth. However, the inhibitory mechanism of endostatin in human endothelial cells has not been characterized yet.