Zobrazeno 1 - 9
of 9
pro vyhledávání: '"J. G. Couillard"'
Publikováno v:
Solid-State Electronics. 42:1689-1696
We report on the impact of substrates on n-channel and p-channel polycrystalline-silicon (poly-Si) thin film transistors (TFTs) performance and hot carrier stress (HCS) reliability. Corning Code 1737 glass, fused silica and oxidized Si were used as s
Publikováno v:
Semiconductor Science and Technology. 13:532-535
We have examined the impact of substrates on the performance and response to hot-carrier stress of polycrystalline silicon n-channel thin film transistors. Non-barrier coated Corning Code 1737 glass, fused silica and oxidized Si were used as substrat
Autor:
J. G. Couillard, Tsu-Jae King, N. J. Binkowski, Francis P. Fehlner, D. Salamida, Chad B. Moore, E. C. Onyiriuka
Publikováno v:
Surface and Interface Analysis. 26:270-277
The surface chemistry of an alkaline-earth boroaluminosilicate glass is changed by contact with chemical solutions. The present study shows that RCA cleaning creates a silica-rich surface on the glass. This altered surface can be removed by hydrofluo
Autor:
S. Cherekdjian, J. G. Couillard, C. Wilcox, Jiro Matsuo, Masataka Kase, Takaaki Aoki, Toshio Seki
Publikováno v:
AIP Conference Proceedings.
Researchers at Corning Incorporated have developed a process whereby single crystal silicon thin films are transferred onto a flat panel display glass substrate using hydrogen ion implantation. The energy of the implant controls the effective exfolia
Publikováno v:
Applied Physics Letters. 61:1040-1042
Ballistic electron emission microscopy (BEEM) has been used to investigate and image microfabricated Au/SiGe features. Electron beam lithography and dry etching were used to construct arrays of holes in a SiO2 layer and etched indentations in SiGe. T
Autor:
J. G. Couillard, Harold G. Craighead
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 12:161
Regions of light‐emitting porous silicon fabricated by anodic electrochemical etching have been patterned by photolithography. Samples were spin‐coated with photoresist, and contact photolithography was used to define the desired mask pattern. Ex
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 11:766
Autor:
J. G. Couillard, Harold G. Craighead
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 11:717
Epitaxial Si1−xGex (x=0.08–0.12) films were reactive ion etched in fluorine‐ and chlorine‐based plasmas. The etch characteristics are similar to those for pure Si. By studying the effects of the etch parameters, such as power, pressure, and g
Publikováno v:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 10:3112
We have applied ballistic electron emission microscopy (BEEM) to microfabricated semiconductor structures in order to study the damage effects of dry etching. Structures were defined in Si0.92Ge0.08 using electron‐beam lithography and reactive‐io