Zobrazeno 1 - 4
of 4
pro vyhledávání: '"J. F. Bohland"'
Autor:
Gary S. Calabrese, R. Sinta, B.W. Dudley, S.K. Jones, J. F. Bohland, P.W. Freeman, E. K. Pavelchek
Publikováno v:
Microelectronic Engineering. 21:231-234
SAHRTM [1–3] ( S ilylated A cid H ardened R esist) employs chemically amplified crosslinking of exposed areas and results in positive-toned features following dry development. Two undersirable characteristics of this process have been identified an
Autor:
E. K. Pavelchek, G. S. Calabrese, S. M. Bobbio, J. F. Bohland, M. Gulla, L. N. Abali, P. Sricharoenchaikit
Publikováno v:
Microelectronic Engineering. 13:93-96
G-line photoresists are exposed at 248 nm and subjected to aqueous development and electroless plating to produce submicron, metallized photoresist patterns. The high plasma etch resistance of the photoresist/metal structure allows for efficient patt
Publikováno v:
The Journal of Physical Chemistry. 77:1969-1971
Publikováno v:
SPIE Proceedings.
The combined effects of diffraction, refraction, reflection, and interference often result in the notching of photoresist lines at steps in the substrate. Dyes have been added to photoresists in order to minimize the notching problem. However, it has