Zobrazeno 1 - 10
of 38
pro vyhledávání: '"J. Diefendorf"'
Autor:
Christina Kasprzak, Lynne Kahn, Joicey Hurth, Susan Goode, Martha J. Diefendorf, Sharon Ringwalt
Publikováno v:
Topics in Early Childhood Special Education. 29:24-39
The National Early Childhood Technical Assistance Center was charged by the U.S. Department of Education's Office of Special Education Programs from October 2001 through September 2006 to develop, implement, and evaluate an approach to technical assi
Autor:
J. Diefendorf, J. Ward
Too often, scholars treat transnationalism as a conflict in which the local, regional, and national give way to globalized identity. As these varied studies of German cities show, though, the urban environment is actually a site of trans-localism tha
Publikováno v:
Journal of Applied Physics. 83:3600-3608
A simple mathematical model based on atomic drift and diffusion is advanced to describe electromigration-induced stress in confined metal lines. Using a finite element approach, a MATLAB program was developed to simulate stress evolution in lines wit
Publikováno v:
Thin Solid Films. :460-464
The microstructure of an integrated circuit interconnect material significantly affects the reliability of the device. Narrow lines with near bamboo structure exhibit an increased mean time to failure (MTF) and a concomitant increase in the dispersio
Autor:
R. J. Diefendorf, R. P. Boisvert
Publikováno v:
Proceedings of the 12th Annual Conference on Composites and Advanced Ceramic Materials: Ceramic Engineering and Science Proceedings
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f982279e1814a46ff25b01d9f451353
https://doi.org/10.1002/9780470310496.ch38
https://doi.org/10.1002/9780470310496.ch38
Autor:
R. J. Diefendorf, R. J. Shinavski
Publikováno v:
Proceedings of the 17th Annual Conference on Composites and Advanced Ceramic Materials: Ceramic Engineering and Science Proceedings
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f77666d4ba63035a008983e94f8aca8
https://doi.org/10.1002/9780470314234.ch16
https://doi.org/10.1002/9780470314234.ch16
Autor:
R. J. Diefendorf, Yongkun Liu
Publikováno v:
Applied Physics Letters. 71:3171-3173
Electromigration-induced stress in near bamboo structure interconnects has been simulated by the finite element method. The maximum stress at the juncture of polygranular clusters and bamboo segments increases when the stress profile interacts with t
Autor:
Yongkun Liu, R. J. Diefendorf
Publikováno v:
MRS Proceedings. 516
Microstructure plays a key role in reliability of interconnects. However, a quantitative correlation between microstructure and reliability of interconnects is lacking. This paper develops a statistical description of effective diffusivity of interco
Publikováno v:
ACS Symposium Series ISBN: 9780841230415
Polymers from Agricultural Coproducts
Polymers from Agricultural Coproducts
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4416b206d33af697ab33260671f2e22
https://doi.org/10.1021/bk-1994-0575.ch012
https://doi.org/10.1021/bk-1994-0575.ch012
Autor:
R. J. Diefendorf, George J Dvorak
Final results obtained on the High Temperature Advanced Structural Composites Program at Rensselaer Polytechnic Institute are described in three volumes. Volume one contains the Executive Summary and reprints of papers on Intermetallic Compounds. Vol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::571d1a0bc4463247659986eb9d50be83
https://doi.org/10.21236/ada267022
https://doi.org/10.21236/ada267022