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pro vyhledávání: '"J. Catrysse"'
Autor:
J. Catrysse, D. Pissoort
Publikováno v:
IEEE Letters on Electromagnetic Compatibility Practice and Applications. 2:67-71
The revision of the standard “IEEE Guide for the Electromagnetic Characterization of Conductive Gaskets in the Frequency Range of DC to 40 GHz” has been published as IEEE Std 1302 – 2019. Since its first edition in 2008, technology has changed
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Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 34:348-351
In the past, different test cells were used to measure the shielding effectiveness (SE) of materials against electromagnetic radiation, for far-field (or plane wave) conditions. Recently, a new standard was approved. However, some errors may occur, e
Autor:
J. Catrysse
Publikováno v:
2008 International Symposium on Electromagnetic Compatibility - EMC Europe.
In this paper, the physical phenomena of unbalance on the power mains network structure related to radiated EM fields caused by BPL signals, are discussed. It is shown that the unbalance of the power mains network is mainly responsible for this radia
Autor:
J. Catrysse
Publikováno v:
2008 IEEE International Symposium on Electromagnetic Compatibility.
In the past, different methods have been defined and some standardised for the characterisation of flat samples of shielding materials. Basically, the methods are based on three principles: coaxial cell methods simulating far field conditions, near-f
Publikováno v:
2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility.
The following document gathers a collection of information and trends about integrated circuit (IC) technology to build a tentative roadmap for ElectroMagnetic Compatibility (EMC) of ICs until year 2020, with focus on embedded system-on-chip (SoC) fo
Autor:
J. Catrysse
Publikováno v:
2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 37:313-315
In mixed signal applications, interference problems due to crosstalk are well known. These problems have also been reported at the VLSI-IC level. A specially designed chip was used for performing crosstalk measurements at the chip level. Some of the
Autor:
J. Catrysse
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 37:310-312
In mixed signal applications, interference problems due to ground noise and substrate noise are well known. The problem is becoming very timely in applications, such as the logical control of analog amplifiers in monolithic technologies, because of t
Autor:
J. Catrysse, R. De Smedt
Publikováno v:
1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261).
Two aspects of the shielding effectiveness of an enclosure are addressed: characteristics of the material of the shield and the leakage through apertures and grids. In both cases a suitable measurement set-up is presented, which enables to concentrat