Analytical multi-step homogenization methodology for a stack of thin films in microelectronics

Autor: Adellah Tougui, P. Gardes, F. Roqueta, E. Le Bourhis, H. F. Miled, J. C. Craveur

Publikováno v: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Jul 2020, Cracow, Poland. pp.1-7, ⟨10.1109/EuroSimE48426.2020.9152652⟩

The manufacturing process causes silicon wafer curvature because of the thermomechanical mismatch between each layers and the substrate. This curvature depends on many factors such as the properties of the used materials (Young’s modulus, Poisson�

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f54cd394fa97f50322d364d1c911e379
https://hal.archives-ouvertes.fr/hal-02972476

Interaction of hybrid pressurised cylindrical structures subjected to blast loading

Autor: G. Mohamed, S Pormente, Alma Hodzic, J C Craveur, Constantinos Soutis

Publikováno v: Plastics, Rubber and Composites. 41:69-76

This paper studies the dynamic behaviour of fibre metal laminate pressurised barrels subjected to internal blast loadings using the multi-material arbitrary Lagrangian–Eulerian (MMALE) formulation within the explicit finite element software RADIOSS

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::61deabcc12c75c6dcfa9d9f03368e531
https://doi.org/10.1179/1743289810y.0000000027

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