Zobrazeno 1 - 10
of 54
pro vyhledávání: '"J. Bardong"'
Publikováno v:
Journal of Sensors and Sensor Systems, Vol 5, Iss 1, Pp 85-93 (2016)
Surface acoustic wave (SAW) temperature sensor devices have been developed for operating temperatures up to and above 1000 °C. A challenging task to make these devices available on the market is to develop an appropriate housing concept. A concept b
Externí odkaz:
https://doaj.org/article/0fad8fb770f34cc69189e815cd278da4
Akademický článek
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Publikováno v:
2016 IEEE International Ultrasonics Symposium (IUS).
SAW devices which are outfitted with an appropriate functional layer are highly promising candidates for small, reliable and cheap gas sensors that can operate at high temperatures and hence measure the composition of exhaust gases very close to the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d1306ec2dbb6e20fc5e240451f28880
https://doi.org/10.1109/ultsym.2016.7728736
https://doi.org/10.1109/ultsym.2016.7728736
Publikováno v:
Procedia Engineering
Surface acoustic wave (SAW) devices are since long known for their wireless sensing capabilities in harsh environment. While the mainstream of the investigations was so far dedicated to room temperature or high temperature applications, we have demon
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9e02d1bc20eb2b97577e4fa2ab3a3e37
https://doi.org/10.1016/j.proeng.2012.09.102
https://doi.org/10.1016/j.proeng.2012.09.102
Publikováno v:
Proceedings SENSOR 2015.
SAW temperature sensor devices have been developed for operating temperatures up to and above 1000°C. A challenging task to make these devices available on the market is to develop an appropriate housing concept. A concept based on low temperature c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::628999206149c38b1f1d78b0aaf0fb79
https://doi.org/10.5162/sensor2015/b5.4
https://doi.org/10.5162/sensor2015/b5.4
Publikováno v:
Applied Physics Letters. 110:184104
There is a need for sensors capable operating at temperatures above 1000 degrees C. We describe an innovative sensor that might achieve this goal. The sensor comprises two main elements: a thermocouple and a surface acoustic wave (SAW) strain sensor.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6162c7467eab11a8b0bb7c18482133a4
https://doi.org/10.1063/1.4983085
https://doi.org/10.1063/1.4983085
Publikováno v:
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
A wafer-level chip-scale packaging scheme that can withstand temperatures of 600°C and above in long-term operation is proposed. The package comprises a SOI case and a cap wafer. In the device layer of the SOI wafer, flexible springs are formed to f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8e95733c322a4970587a81cf88a3ba0
https://doi.org/10.1109/ltb-3d.2014.6886178
https://doi.org/10.1109/ltb-3d.2014.6886178
Autor:
J. Bardong, R. Fachberger
Publikováno v:
2010 IEEE International Frequency Control Symposium.
A high temperature stable packaging for surface acoustic wave devices for application of radio frequency transponders in harsh environment was investigated. Several ceramic adhesives were tested and characterized for die bonding. The expected thermal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f04070cdca11e3074ca18ebf66c15d91
https://doi.org/10.1109/freq.2010.5556325
https://doi.org/10.1109/freq.2010.5556325
Akademický článek
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Akademický článek
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