Zobrazeno 1 - 10
of 22
pro vyhledávání: '"J. A. Prybyla"'
Publikováno v:
Journal of The Electrochemical Society. 140:2695-2702
Growth of clean (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdabd0740eaa91b1c8035e45db3b8558
https://doi.org/10.1149/1.2220889
https://doi.org/10.1149/1.2220889
Publikováno v:
Physical Review Letters. 68:503-506
The laser-induced desorption of CO molecules from a Cu(111) surface is time resolved with 100-fsec resolution. We find the desorption reaction is completed in ≤ 325 fsec after the 100-fsec, 2-eV photon energy pump pulse. The only mechanism consiste
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::253f059a35e777982caa238152efaf8f
https://doi.org/10.1103/physrevlett.68.503
https://doi.org/10.1103/physrevlett.68.503
Publikováno v:
Applied Physics Letters. 76:164-166
In situ transmission electron microscopy experiments on electromigration in Al(0.5%Cu)/TiN interconnects show that the TiN barrier layer improves reliability not only by acting as a shunting layer, but also by dramatically influencing electromigratio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3be2276532e5113ac5d4049c2684485
https://doi.org/10.1063/1.125690
https://doi.org/10.1063/1.125690
Publikováno v:
The Journal of Chemical Physics. 94:6274-6295
Low energy electron diffraction (LEED) and surface infrared spectroscopy (SIRS) have been used to investigate the phase diagram of the H/Mo(100) chemisorption system, for hydrogen coverages up to saturation in the temperature interval 100 K
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c08bd7ab1dd020b39c2301cb2371ce80
https://doi.org/10.1063/1.460417
https://doi.org/10.1063/1.460417
Publikováno v:
Applied Physics Letters. 75:3790-3792
Crystallographic grain orientations at a large number of electromigration failure sites in Al(Cu) interconnects have been measured and compared to the grain orientations away from failure sites. Electron backscattered diffraction analysis reveals a p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac51094f37704c00e3256a4d7f7de3c6
https://doi.org/10.1063/1.125457
https://doi.org/10.1063/1.125457
Publikováno v:
Applied Physics Letters. 73:1083-1085
Real-time transmission electron microscopy (TEM) was used to directly examine the temperature dependence of electromigration-induced void and failure dynamics over the range 200–350 °C. The studies were done using submicron Al interconnects and a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d169f2b8445ed395f721b85b11d745e0
https://doi.org/10.1063/1.122091
https://doi.org/10.1063/1.122091
Publikováno v:
Applied Physics Letters. 70:2541-2543
Investigations of the healing of electromigration-induced open-circuit failed submicron Al(0.5%Cu) interconnects were performed using in situ transmission electron microscopy (TEM). The samples consisted of 4000 A thick Al (0.5%Cu) patterned over a T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d981a4467a61842c052261b76c0722f6
https://doi.org/10.1063/1.118914
https://doi.org/10.1063/1.118914
Publikováno v:
Applied Physics Letters. 69:2367-2369
Systematic studies of the influence of local microstructure on electromigration (EM) dynamics in submicron Al (0.5 wt % Cu) interconnects were performed using in situ transmission electron microscopy. This approach has allowed us to observe, in real
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1fe12a33622c1b3e7362ad45bd5292e3
https://doi.org/10.1063/1.117527
https://doi.org/10.1063/1.117527
Publikováno v:
Applied Physics Letters. 68:2372-2374
The stress coefficient of resistivity (piezoresistance coefficient) of passivated submicron Al‐Cu lines was determined using a wafer‐bending technique. This coefficient is significant for the interpretation of early resistance changes in reliabil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8df64e057c648fe2ffbcb37a727e883b
https://doi.org/10.1063/1.116137
https://doi.org/10.1063/1.116137
The Effect of Cu Concentration and Distribution on the Lifetimes of Submicron, Bamboo Al(Cu) Runners
Publikováno v:
MRS Proceedings. 473
We have studied the effect of Cu concentration and initial distribution on the electromigration lifetimes of 0.3 – 0.8 μm wide, ≥ 99% bamboo Al interconnects. The mechanism by which Cu reduces electromigration in polygranular interconnects may n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84cc9da06bae5d8d61056641222b447f
https://doi.org/10.1557/proc-473-387
https://doi.org/10.1557/proc-473-387