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Impact of magneto-dielectric materials on the miniaturization of UWB monopole antennas

Autor: A-C. Tarot, A. Kabalan, Patrick Queffelec, Ala Sharaiha, David Souriou, J-L. Mattei

Publikováno v: IEEE International Workshop on Antenna Technology (iWAT)
IEEE International Workshop on Antenna Technology (iWAT), Mar 2018, Nanjing, China. ⟨10.1109/iwat.2018.8379224⟩

International audience; This article presents the miniaturization of an UWB planar monopole antenna covering the VHF band through the use of low loss Magneto-Dielectric Materials (MDM). A new structure of the planar monopole antenna using slots have

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::316c600abc5c7787d72512a59ca26fff
https://univ-rennes.hal.science/hal-01861303

Ultra-Miniature UHF Antenna using Magneto-dielectric Material

Autor: J.-F. Pintos, J. Perraudeau, J-L. Mattei, D. Souriou, Ali Louzir, Patrick Queffelec, Philippe Minard

Publikováno v: 14th International Symposium on Antenna Technology and Applied Electromagnetics (ANTEM 2010)
14th International Symposium on Antenna Technology and Applied Electromagnetics (ANTEM 2010), Jul 2010, Ottawa, Canada
HAL

This paper introduces an ultra-miniature UHF antenna. The design combines different technologies to reduce the size:(meta-material inspired shape, use of a magneto-dielectric material as antenna support, use of an active component and a passive match

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::272c409c1e76c1420f9798918bbc6345
https://hal.univ-brest.fr/hal-00492290

Inductance Effect in Crosstalk Prediction

Autor: G. Servel, J.-L. Mattei, D. Deschacht, F. Saliou, Fabrice Huret

Publikováno v: IEEE Transactions on Advanced Packaging
IEEE Transactions on Advanced Packaging, Institute of Electrical and Electronics Engineers, 2002, 25 (3), pp.340-346. ⟨10.1109/TADVP.2002.806732⟩

International audience; Rapid progress in integrated circuit technology has led to an increase in switching speeds of digital circuits. This increase is the primary reason why inductance noise causes chips to fail. As a result, there is a growing int

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::34a3df56dda80dfea2369ca9badf4d43
https://hal-lirmm.ccsd.cnrs.fr/lirmm-00268583

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