Zobrazeno 1 - 10
of 106
pro vyhledávání: '"J Jakovenko"'
Publikováno v:
Radioengineering, Vol 28, Iss 3, Pp 598-609 (2019)
This article describes waffle power MOSFET segmentation and defines its analytic models. Although waffle gate pattern is well-known architecture for effective channel scaling without requirements on process modification, no until today precise model
Externí odkaz:
https://doaj.org/article/9bbc32a7da06432f8c5d655c4ce6a848
Autor:
T. Napravnik, J. Jakovenko
Publikováno v:
Radioengineering, Vol 27, Iss 3, Pp 784-795 (2018)
Novel automated simulator-independent ESD model characterization method based on Differential evolution and Nelder-Mead Simplex algorithms is presented in this paper. It offers an alternative for time and human-resources demanding manual characteriza
Externí odkaz:
https://doaj.org/article/26c8dc4044bf46bfa47f417c6962ea2f
Publikováno v:
Radioengineering, Vol 27, Iss 3, Pp 796-805 (2018)
A true random number generator (TRNG) with time multiplexed metastability-based sources of randomness, presented in this paper, is capable of generating random bit sequences formed from noise present in the electronic circuit. An incorporated time mu
Externí odkaz:
https://doaj.org/article/262a981d589d468c8977d4593874b9f2
Autor:
M. Jelinek, J. Jakovenko
Publikováno v:
Radioengineering, Vol 26, Iss 2, Pp 515-521 (2017)
This paper provides analysis of output capacitor effects to phase stability of a hysteretic mode controlled buck converter. The hysteretic control method is a simple and fast control technique for switched-mode converters, but the hysteresis control
Externí odkaz:
https://doaj.org/article/dc56a744dc024954b7fcbe2630e5cee5
Autor:
M. Kubar, J. Jakovenko
Publikováno v:
Radioengineering, Vol 22, Iss 3, Pp 921-931 (2013)
This paper presents a new optimization tool for analog circuit design. Proposed tool is based on the robust version of the differential evolution optimization method. Corners of technology, temperature, voltage and current supplies are taken into acc
Externí odkaz:
https://doaj.org/article/5f6a10024ee94ee085f667c58d8a9500
Autor:
J. Formanek, J. Jakovenko
Publikováno v:
Radioengineering, Vol 22, Iss 1, Pp 245-250 (2013)
This work presents a detailed 3-D thermo-mechanical modelling of two LED board technologies to compare their performance. LED board are considered to be used in high power 800 lumen retrofit SSL (Solid State Lighting) lamp. Thermal, mechanical and li
Externí odkaz:
https://doaj.org/article/8675765c255d416b9228f0b779ff414c
Autor:
J. Jirsa, J. Gecnuk, Z. Janoska, J. Jakovenko, V. Kafka, M. Marcisovsky, M. Marcisovska, P. Stanek, L. Tomasek, P. Vancura
Publikováno v:
Journal of Instrumentation. 18:C02033
Precise physical models of sensors are essential for developing high precision pixelated detectors. Advanced technologies allowed pixel electronics to be integrated in tens of micrometers pixel pitch. Such fine pixelated detectors suffer from charge
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ff8c4be7f570398bf8862c02f115e39
https://doi.org/10.1088/1748-0221/18/02/c02033
https://doi.org/10.1088/1748-0221/18/02/c02033
Publikováno v:
Radioengineering, Vol 21, Iss 1, Pp 225-230 (2012)
Thermal and thermo-mechanical modeling and characterization of solid state lightening (SSL) retrofit LED lamp are presented in this paper. Paramount importance is to design SSL lamps for reliability, in which thermal and thermo-mechanical aspects are
Externí odkaz:
https://doaj.org/article/b570b045be10493d9cc2f1f68ffb5997
Publikováno v:
Radioengineering, Vol 21, Iss 1, Pp 231-238 (2012)
This paper discusses the design of an electrostatic generator, power supply component of the self-powered microsystem, which is able to provide enough energy to power smart sensor chains or if necessary also other electronic monitoring devices. One o
Externí odkaz:
https://doaj.org/article/fb0e55dafcf9417a9d9fc1b8cdbd43e4
Publikováno v:
Journal of Physics: Conference Series. 2374:012130
Pixel detectors become an integral part of medical imaging, nondestructive testing, space science and particle physics. Sensors that are bump bonded to readout ASICs are made from various materials such as GaAs, Si, CdTe, and CdZnTe. Current research
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f93554da4c2d25bf6e035ebc3bf9948a
https://doi.org/10.1088/1742-6596/2374/1/012130
https://doi.org/10.1088/1742-6596/2374/1/012130