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pro vyhledávání: '"Jürgen Michael Süss"'
Autor:
Florian Kurz, Jürgen Michael Süss, Thomas Plach, Bernhard Rebhan, Viorel Dragoi, Thomas Wagenleitner, Dominik Zinner
Publikováno v:
ECS Transactions. 75:345-353
The increased microelectronic devices complexity is raising a strong demand for high wafer-to-wafer (w2w) alignment accuracy allowing for high levels of integration by wafers stacking. One of the major aspects for the alignment is the overlay alignme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9f42ff9c7c73dc5e54687e203941f914
https://doi.org/10.1149/07509.0345ecst
https://doi.org/10.1149/07509.0345ecst
