Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Jörg Frömel"'
Autor:
Sylwester Bargiel, Maciej Baranski, Maik Wiemer, Jörg Frömel, Wei-Shan Wang, Christophe Gorecki
Publikováno v:
Micromachines, Vol 10, Iss 3, p 185 (2019)
We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combi
Externí odkaz:
https://doaj.org/article/6a55bdac34ed4c87bbf20b36a9d412e8
Autor:
Christophe Gorecki, Sylwester Bargiel, Jörg Frömel, Maik Wiemer, Maciej Baranski, Wei Shan Wang
Publikováno v:
Micromachines, Vol 10, Iss 3, p 185 (2019)
Micromachines
Volume 10
Issue 3
Micromachines
Volume 10
Issue 3
We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combi
Autor:
Blandine Guichardaz, Etienne Herth, Maik Wiemer, Maciej Baranski, Sylwester Bargiel, Christophe Gorecki, Nicolas Passilly, C. Jia, Jörg Frömel
Publikováno v:
IEEE Photonics Technology Letters
IEEE Photonics Technology Letters, Institute of Electrical and Electronics Engineers, 2014, 26, pp.100-103. ⟨10.1109/LPT.2013.2289981⟩
IEEE Photonics Technology Letters, Institute of Electrical and Electronics Engineers, 2014, 26, pp.100-103. ⟨10.1109/LPT.2013.2289981⟩
International audience; This letter reports on the development of an integrated micro-optical beam splitter that can be array-arranged. The proposed wafer-level fabrication, based on 45° saw-dicing of glass substrates, allows rapid and low-cost proc
Autor:
Sylwester Bargiel, Maik Wiemer, Jörg Frömel, Christophe Gorecki, D. Wünsch, Maciej Baranski, Wei Shan Wang, Nicolas Passilly
Publikováno v:
SPIE Proceedings.
We describe a technological platform developed for miniaturization of optical imaging instruments, such as laser scanning confocal microscopes or Optical Coherence Tomography devices. The platform employs multi-wafer vertical integration approach, co
Publikováno v:
Journal of Micromechanics and Microengineering. 27:015029
In this paper, a novel wafer-level hermetic packaging technology for heterogeneous device integration is presented. Hermetic sealing is achieved by low-temperature thermo-compression bonding using electroplated Au micro-sealing frame planarized by si
Autor:
C. Jia, Nicolas Passilly, E. Herth, Maciej Baranski, Christophe Gorecki, Maik Wiemer, Sylwester Bargiel, B. Guichardaz, Jörg Frömel
Publikováno v:
2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).
This work presents the development of an integrated micro-optical beam splitter that can be arranged in array, and based on saw-dicing of glass substrates. The latter allows a rapid and rather low-cost processing, and in addition leads to high compac
Autor:
Nicolas Passilly, C. Jia, Maciej Baranski, Jörg Frömel, Maik Wiemer, Sylwester Bargiel, Christophe Gorecki
Publikováno v:
SPIE Proceedings.
We present the preliminary design, construction and technology of a microoptical, millimeter-size 3-D microlens scanner, which is a key-component for a number of optical on-chip microscopes with emphasis on the architecture of confocal microscope. Th
Autor:
Jörg Frömel, Christophe Gorecki, Maik Wiemer, C. Jia, Nicolas Passilly, Sylwester Bargiel, Maciej Baranski
Publikováno v:
Procedia Engineering
Procedia Engineering, Elsevier, 2012, 47, pp.1133-1136
Procedia Engineering, Elsevier, 2012, 47, pp.1133-1136
International audience; This paper describes crucial technological aspects of development of an optical, transmissive, vertically-integrated 3-D microscanner: chip-level bonding of micro-optical components and wafer-level anodic bonding of deeply str
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ef9d799ab0e19d26c1f3152905d6efba
https://publica.fraunhofer.de/handle/publica/231066
https://publica.fraunhofer.de/handle/publica/231066
Autor:
Steffen Kurth, Koichi Ikeda, Jörg Frömel, Thomas Gessner, Stefan Leidich, Akira Akiba, Wolfgang Faust, Andreas Bertz, Christian A. Kaufmann, M. Nowack
Publikováno v:
SPIE Proceedings.
This contribution deals with capacitively actuated Ohmic switches in series single pole single throw (SPST) configuration for DC up to 4 GHz signal frequency (
Autor:
Jörg Frömel, Mario Baum, Maik Wiemer, Jörg Bräuer, Lutz Hofmann, Masayoshi Esashi, Yu-Ching Lin, Thomas Gessner
Publikováno v:
2009 IEEE 3rd International Conference on Nano/Molecular Medicine and Engineering.
Microsystems that are used for medical application mostly consist of temperature sensible components. Therefore the temperatures during the fabrication process must be limited. This paper deals with the fabrication of reactive nanostructures that hav