Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Ivaylo Mitev"'
Autor:
Ventsislav Boshnakov, Ivaylo Mitev, Stojan Lazarov, Dimitar Pechilkov, Beatrice Desnous, Fedoua El Louali, Loic Macé, Virginie Fouilloux, Marien Lenoir
Publikováno v:
Brazilian Journal of Cardiovascular Surgery, Vol 38, Iss 5 (2023)
ABSTRACT Introduction: Homografts and bovine jugular vein are the most commonly used conduits for right ventricular outflow tract reconstruction at the time of primary repair of truncus arteriosus. Methods: We reviewed all truncus patients from 1990
Externí odkaz:
https://doaj.org/article/ab15714e6ca84d3eb9ec1593e2726583
Autor:
Mario Gschwandl, Birgit Friedrich, Martin Pfost, Thomas Antretter, Peter Filipp Fuchs, Ivaylo Mitev, Qi Tao, Angelika Schingale
Publikováno v:
Microelectronics Reliability. 133:114537
Autor:
Angelika Schingale, Qi Tao, Thomas Antretter, Peter Filipp Fuchs, Mario Gschwandl, Martin Pfost, Ivaylo Mitev
Publikováno v:
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Power electronics are key-enablers of several industry trends, such as more efficient renewable energy harvesting, eco-friendly mobility and many more. With their uprising use and versatility the requirement for these packages is steadily increasing;
Autor:
Ventsislav Boshnakov, Stojan Lazarov, George Konstantinov, Ivaylo Mitev, Dimitar Pechilkov, Plamen D. Mitev
Publikováno v:
World journal for pediatriccongenital heart surgery. 11(4)
We describe a case of a low birth weight neonate who presented on second day of life with progressive cyanosis and oxygen saturation of 60% by pulse oximetry. The echocardiography examination revealed a large tumor-like mass connected to the tricuspi
A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip
Autor:
Martin Pfost, Mario Gschwandl, Michael Decker, Ivaylo Mitev, T. Krivec, Thomas Antretter, Angelika Schingale, Peter Filipp Fuchs, Tao Qi
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
The shift of the automotive industry towards e-mobility results in a strong demand for highly reliable power electronics. A major goal in their design is to improve the thermal management of all components. Most commonly power electronics are subject
Autor:
Tao Qi, Ivaylo Mitev, Peter Filipp Fuchs, Archim Wolfberger, Michael Feuchter, Thomas Antretter, Mahesh Yalagach
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
Microelectromechanical systems (MEMS) and MEMS packaging solutions are gaining increased interests for electronic applications. These packages feature a variety of polymeric materials and composites e.g. fiber reinforced polymer laminates, insulating
Autor:
Angelika Schingale, Mario Gschwandl, Peter Filipp Fuchs, Ivaylo Mitev, Mahesh Yalagach, Thomas Antretter, Tao Qi
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Due to the advancement of electric mobility in recent years, the need for reliable power electronics has risen exponentially. To enable a proper lifetime assessment of modern high power electronics finite element analysis (FEA) is widely used in indu
Publikováno v:
Engineering Fracture Mechanics. 78:3049-3058
Using linear elastic fracture mechanics a new methodology for a lifetime assessment of internally pressurized polymer pipes was developed. The concept is based on the numerical calculation of stress intensity factors for pipes under different loading