Zobrazeno 1 - 10
of 92
pro vyhledávání: '"Ivan Szendiuch"'
Publikováno v:
Soldering & Surface Mount Technology, 2015, Vol. 27, Issue 4, pp. 157-163.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SSMT-10-2014-0021
Autor:
Milan Hurban, Ivan Szendiuch
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a174178e54afb302816c9d0385944a7
https://doi.org/10.1109/isse54558.2022.9812804
https://doi.org/10.1109/isse54558.2022.9812804
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
This article deals with the possibilities of representing the detail of solder ball inner structure more precisely using two methods of sample preparation. The first method of sample preparation is standard metallographic microsection with grinding a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::89b65c6a8012756633dffd5c091389e4
https://doi.org/10.1109/isse51996.2021.9467626
https://doi.org/10.1109/isse51996.2021.9467626
Publikováno v:
2020 43rd International Spring Seminar on Electronics Technology (ISSE).
This paper deals with the current-carrying capacity of silver cermet thick-film conductors. Ten different patterns of thick-film conductors were created on the alumina substrate (96 % Al$_{2}O_{3}$). The electrical current load concerning the width o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01867eced33af40f7103b793a1a9f6bc
https://doi.org/10.1109/isse49702.2020.9121000
https://doi.org/10.1109/isse49702.2020.9121000
Publikováno v:
2020 43rd International Spring Seminar on Electronics Technology (ISSE).
The main aim of this work was to determine and summarize the applicability of etching solutions for the preparation of examined solder joint samples after metallographic cross-sections. Each etchant has different etching rate for every element and co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bfc827a93d745fb81632eea2181da826
https://doi.org/10.1109/isse49702.2020.9121138
https://doi.org/10.1109/isse49702.2020.9121138
Publikováno v:
2020 43rd International Spring Seminar on Electronics Technology (ISSE).
Influencing the environment is increasing worldwide every day due to growing production. Electric and electronic products, which are produced every day in countless quantities, contribute to this great extent. Therefore, it is necessary to seek and e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0eb49692355f95786d078084dde482bc
https://doi.org/10.1109/isse49702.2020.9120964
https://doi.org/10.1109/isse49702.2020.9120964
Autor:
Ivan Szendiuch
Publikováno v:
The Educational Review. 2020, vol. 4, issue 2, p. 263-269.
This contribution gives some practical experience about the education program in the microelectronics assembly technology, as part of the base of hardware. It is closed to modern technologies of electronic packaging and interconnection. The subject
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f4399b50d71c01a214d9e54d4e9f5c27
https://hdl.handle.net/11012/193379
https://hdl.handle.net/11012/193379
Autor:
Alexandr Otahal, Ivan Szendiuch
Publikováno v:
Journal of Electrical Engineering. 2018, vol. 69, issue 4, p. 305-310.
This paper deals with the research of an intermetallic layer of SAC305 solder balls soldered from three directions of the heat flow in the ball-attach process for BGA package. From the point of view of the heat flow direction, the samples were solder
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::970b2bdd581800e18a94b7baf82cf65c
https://doi.org/10.2478/jee-2018-0043
https://doi.org/10.2478/jee-2018-0043
Autor:
Ivan Szendiuch, Vladimir Sitko
Publikováno v:
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).
Currently, electronic assemblies are more complex and compact. Requirements on the reliability of electronic assemblies in a harsh environment are rapidly growing. Assemblies become dense, with small distances between poles. Processing of low and ver
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b91447b1ac4883ed8ac227471ce8c71e
https://doi.org/10.23919/empc44848.2019.8951759
https://doi.org/10.23919/empc44848.2019.8951759
Publikováno v:
2019 42nd International Spring Seminar on Electronics Technology (ISSE).
This paper deals with the possibility of affecting the creation of solder inner structure under the flow of electric current. The soldering apparatus with a special electrode system has been developed. The reflow of the solder occurred in a quartz gl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7181b31c93c5e32bf0a2e604b889835
https://doi.org/10.1109/isse.2019.8810308
https://doi.org/10.1109/isse.2019.8810308