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pro vyhledávání: '"Ivan A. N. Goh"'
Publikováno v:
International Symposium for Testing and Failure Analysis.
As semiconductor technology advances from one node to the next, fabrication also becomes increasingly challenging to ramp up production with the most desirable yield and reliable product in a timely manner. At an advanced technology node such as 65nm
Publikováno v:
International Symposium for Testing and Failure Analysis.
During the wafer-sort stage, critical electrical data on the IC chip performance is collected. As technology advances, smaller geometries are continuously implemented to the production line and, as a result, there may be some issues that are difficul