Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Itir Akgun"'
Publikováno v:
IEEE Micro. 39:46-53
Monolithic three-dimensional (M3D) integration is viewed as a promising improvement over through-silicon-via-based 3-D integration due to its greater inter-tier connectivity, higher circuit density, and lower parasitic capacitance. With M3D integrati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2193aa122b19f0be8f3f387aa07ecc8
https://doi.org/10.1109/mm.2019.2937726
https://doi.org/10.1109/mm.2019.2937726
Autor:
Xin Ma, Xiaochun Ye, Han Li, Lei Deng, Abanti Basak, Zhimin Zhang, Peng Gu, Dongrui Fan, Mingyu Yan, Shuangchen Li, Yuan Xie, Itir Akgun, Xing Hu, Yujing Feng
Publikováno v:
MICRO
Graph analytics is an emerging application which extracts insights by processing large volumes of highly connected data, namely graphs. The parallel processing of graphs has been exploited at the algorithm level, which in turn incurs three irregulari
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b4c6bceff7804e1444c84a82218026f
https://doi.org/10.1145/3352460.3358318
https://doi.org/10.1145/3352460.3358318
Autor:
Xing Hu, Itir Akgun, Yuan Xie, Xin Ma, Xiaochun Ye, Han Li, Dongrui Fan, Zhimin Zhang, Shuangchen Li, Mingyu Yan, Lei Deng
Publikováno v:
ISLPED
Domain-specific accelerators for graph analytics leverage a large on-chip memory in order to tackle the intensive random memory accesses, offering higher performance and energy efficiency than conventional architectures. However, limited by the ineff
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba73700403bcc3820721acb6033d6395
https://doi.org/10.1109/islped.2019.8824832
https://doi.org/10.1109/islped.2019.8824832
Publikováno v:
DAC
Emerging Monolithic Three-Dimensional (M3D) integration technology will not only provide improved circuit density through the high-bandwidth coupling of multiple vertically-stacked layers, but it can also provide new architectural opportunities for o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b172591ca6bcdbf4ddbedea4581ea4c
https://doi.org/10.1145/3316781.3323475
https://doi.org/10.1145/3316781.3323475
Publikováno v:
SLIP
Interposer-based packaging is becoming a widespread methodology for tightly integrating multiple heterogeneous dies into a single package, with the potential to improve manufacturing yield and build larger-than-reticle-sized systems. However, interpo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ead0b0b8f6a76e21bb4c798af7d8987
https://doi.org/10.1109/slip.2019.8771333
https://doi.org/10.1109/slip.2019.8771333
Publikováno v:
DATE
Homomorphic encryption is a promising technology for enabling various privacy-preserving applications such as secure biomarker search. However, current implementations are not practical due to large performance overheads. A homomorphic encryption sch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aee45920489bb50c880b85ddbe35bcd7
https://doi.org/10.23919/date.2019.8715108
https://doi.org/10.23919/date.2019.8715108
Publikováno v:
ISCA
High-performance computing, enterprise, and datacenter servers are driving demands for higher total memory capacity as well as memory performance. Memory "cubes" with high per-package capacity (from 3D integration) along with high-speed point-to-poin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b89d04f80d428b1be523c4785dd6dd2
https://doi.org/10.1145/3079856.3080251
https://doi.org/10.1145/3079856.3080251
Publikováno v:
ICCAD
Due to the increasing fabrication and design complexity with new process nodes, the cost per transistor trend originally identified in Moore's Law is slowing when using traditional integration methods. However, emerging die-level integration technolo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::804b803f209fe587f08e50e619e59b51
https://doi.org/10.1145/2966986.2980095
https://doi.org/10.1145/2966986.2980095
Publikováno v:
ICCD
Three-dimensional (3D) integration is considered as a solution to overcome capacity, bandwidth, and performance limitations of memories. However, due to thermal challenges and cost issues, industry embraced 2.5D implementation for integrating die-sta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a90f88d81de4f35f9b0194d9caa66c4
https://doi.org/10.1109/iccd.2016.7753258
https://doi.org/10.1109/iccd.2016.7753258
Publikováno v:
2016 49th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a91563280bdb2e984baa5540a885cad0
https://doi.org/10.1109/micro.2016.7783732
https://doi.org/10.1109/micro.2016.7783732