Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Ismail Recepi"'
Publikováno v:
2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Publikováno v:
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
3D finite element analyses of high fidelity and simplified power semiconductor package models are compared to identify essential model features. The paper investigates interaction between heat dissipating power semiconductor devices and nearby, surro