Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Ishigaki Masaki"'
Autor:
Ishigaki, Masaki
Publikováno v:
試論. 46:1-11
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=jairo_______::d7834bf0a3013a53a967452bd29072f1
http://repo.komazawa-u.ac.jp/opac/repository/all/MD40140417/
http://repo.komazawa-u.ac.jp/opac/repository/all/MD40140417/
Autor:
Ishigaki, Masaki
Publikováno v:
試論. 45:15-26
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=jairo_______::1cac47ec595f38ae74d946d99249c25d
http://repo.komazawa-u.ac.jp/opac/repository/all/MD40139608/
http://repo.komazawa-u.ac.jp/opac/repository/all/MD40139608/
Publikováno v:
2019 International Wafer Level Packaging Conference (IWLPC).
In recent years, the demands for higher speed and smaller and thinner semiconductor devices are increasing, and the demand for fan-out wafer level package (FOWLP) technology is expected to grow in the future [1]–[3]. Resin formulation for FOWLP is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df101dcdbc776f660ed13aea44ad2037
https://doi.org/10.23919/iwlpc.2019.8913990
https://doi.org/10.23919/iwlpc.2019.8913990
Publikováno v:
2013 Federated Conference on Computer Science & Information Systems; 2013, p347-354, 8p