Zobrazeno 1 - 10
of 117
pro vyhledávání: '"Ishibashi, Hidetoshi"'
Autor:
Ishibashi, Hidetoshi, Motohashi, Hideyuki H., Kumon, Mami, Yamamoto, Kazuhiro, Okada, Hironori, Okada, Takashi, Seki, Kazuhiko
Publikováno v:
In Reproductive Biology June 2013 13(2):139-144
Autor:
Okada, Hironori, Ishibashi, Hidetoshi, Hayashita-Kinoh, Hiromi, Chiyo, Tomoko, Nitahara-Kasahara, Yuko, Baba, Yukihiro, Watanabe, Sumiko, Takeda, Shin'ichi, Okada, Takashi
Publikováno v:
In Molecular Therapy - Nucleic Acids 2013 2
Autor:
Koshiba, Mamiko, Mimura, Koki, Sugiura, Yasushi, Okuya, Teruhisa, Senoo, Aya, Ishibashi, Hidetoshi, Nakamura, Shun
Publikováno v:
In Progress in Neuropsychopharmacology & Biological Psychiatry 2011 35(6):1499-1504
Autor:
Ishibashi, Hidetoshi (AUTHOR) ishiba@tokyo-med.ac.jp, Motohashi, Hideyuki (AUTHOR)
Publikováno v:
Laboratory Animals. Dec2024, p1.
Akademický článek
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Publikováno v:
International Symposium on Microelectronics. 2018:000470-000475
Press-fit technology has been expected as a mounting technique instead of soldering in power electronics. To apply press-fit technology to power modules, the basic behavior of the contact resistance and an interface reaction of the press-fit contact
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db3e96ee9e244fa85ca5740c2a3a85f1
https://doi.org/10.4071/2380-4505-2018.1.000470
https://doi.org/10.4071/2380-4505-2018.1.000470
Publikováno v:
Journal of Smart Processing. 7:139-145
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea055907026a99a1a3ce023fe7c043b4
https://doi.org/10.7791/jspmee.7.139
https://doi.org/10.7791/jspmee.7.139
Autor:
Ueda, Tesuo, Nawa, Yoshiaki, Masuda, Kozo, Ishibashi, Hidetoshi, Hara, Yoshiaki, Uozato, Hiroshi
Publikováno v:
In Journal of Cataract & Refractive Surgery 2005 31(11):2084-2087
Autor:
Ayumi Minamide, Murata Daisuke, Hodaka Rokubuichi, Asaji Nobuhiro, Morisaki Shota, Ishibashi Hidetoshi, Hiroshi Yoshida
Publikováno v:
2019 International Conference on Electronics Packaging (ICEP).
Power module is used in a wide range of fields such as, home appliance, industry, railway, automobile, renewal energy, and so on. Recently, it is increasing to be required miniaturization of footprint and higher reliability to power modules. This pap
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a38f0de056e76ad7d16e2e6bdd0d77cf
https://doi.org/10.23919/icep.2019.8733451
https://doi.org/10.23919/icep.2019.8733451
Autor:
Kumashiro, Mari *, Ishibashi, Hidetoshi, Uchiyama, Yukari, Itakura, Shoji, Murata, Akira, Iriki, Atsushi
Publikováno v:
In International Journal of Psychophysiology 2003 50(1):81-99