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Autor:
Iseok Sim, Seongju Park, Kwon-Yong Shin, Chanwoo Yang, Heuiseok Kang, Jun Young Hwang, Seung-Jae Moon
Publikováno v:
Coatings; Volume 13; Issue 4; Pages: 683
The field of printed electronics for highly integrated circuits and energy devices demands very fine and highly conductive electric interconnections. In this study, conductive lines having a high cross-sectional aspect ratio were printed via the inkj
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::793dc6db71ceb88c2cdfe131d3827deb
