Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Isamu Yanada"'
Autor:
Katsuaki Suganuma, Sun-Sik Kim, Keun-Soo Kim, Isamu Yanada, Masanobu Tsujimoto, Yuuhi Yorikado
Publikováno v:
Journal of Alloys and Compounds. 558:125-130
The establishment of lead-free plating technology and countermeasures for whisker formation are some of the critical issues remaining to be solved for lead-free electronics packaging. This study examined a method for mitigating Sn whisker formation b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12650db753b04d510beab80b44d97b08
https://doi.org/10.1016/j.jallcom.2013.01.051
https://doi.org/10.1016/j.jallcom.2013.01.051
Autor:
Shih Kang Lin, Yuhi Yorikado, Isamu Yanada, Katsuaki Suganuma, Junxiang Jiang, Keun-Soo Kim, Sinn-wen Chen, Masanobu Tsujimoto
Publikováno v:
Journal of Materials Research. 22:1975-1986
In this study, we investigated mechanical deformation-induced Sn whisker growth, which is frequently encountered in advanced flexible substrate packaging. Concentrated compressive stresses are introduced around the leads and solder surface finish joi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6aeafed35a24491264d348649c8afd51
https://doi.org/10.1557/jmr.2007.0232
https://doi.org/10.1557/jmr.2007.0232
Autor:
Sinn-wen Chen, Katsuaki Suganuma, Yuhi Yorikado, Masanobu Tsujimoto, Junxiang Jiang, Shih Kang Lin, Keun-Soo Kim, Isamu Yanada
Publikováno v:
Journal of Electronic Materials. 36:1732-1734
The development of the microstructure of mechanical-deformation-induced Sn whiskers on electroplated films has been examined using a focused ion beam system (FIB). The 6-μm-thick matte Sn films were compressed by using a ZrO2 ball indenter under amb
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3644bb38993978fe3d9fb1ec6e7ebab1
https://doi.org/10.1007/s11664-007-0284-4
https://doi.org/10.1007/s11664-007-0284-4
Conference
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