Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Isamu Morisako"'
Long-term Reliability of Nickel Micro-Plating Bonding by Using Resonant Type Fatigue Testing Machine
Publikováno v:
QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY. 40:1-8
Publikováno v:
Japanese Journal of Applied Physics. 62:012001
It is popular to research promoting the light conversion efficiency of crystalline silicon solar cell photovoltaic (PV) modules. However, excellent light conversion efficiency does not mean it could maintain initial performance after long-term runnin
Autor:
Kohei Tatsumi, Tomonori Iizuka, Masayuki Hikita, Rikiya Kamimura, Tomoya Itose, Itaru Miyazaki, Isamu Morisako, Keiko Koshiba, Naoki Fukui
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
As for the IGBT power device based on Si used for the vehicle, the performance limit of the Si semiconductor has been pointed out, and the SiC semiconductor has been attracting attention as a next-generation semiconductor. The SiC semiconductor has a
Publikováno v:
IEEJ Transactions on Sensors and Micromachines. 137:59-64
Autor:
Shimizu Koji, Keiji Toda, Kazuhiro Tsuruta, Naoki Kawanabe, Tomonori Iizuka, Masayuki Hikita, Rikiya Kamimura, Nobuaki Sato, Keiko Wada, Isamu Morisako, Kazuhiko Sugiura, Kazutoshi Ueda, Kohei Tatsumi, Minoru Fukuomori
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
New bonding technologies, which can deliver high-temperature thermal resistance that replaces solder bonding or Al wire bonding, have been strongly expected in order to maximize the performance of SiC power device. Aiming for application to the inver
Autor:
Akihiro Imakiire, Kohei Tatsumi, Akihiro Kawagoe, Masahiro Kozako, Keiji Toda, Kazuhiro Tsuruta, Shimizu Koji, Tomoya Itose, Nobuaki Sato, Tomonori Iizuka, Masayuki Hikita, Kazuhiko Sugiura, Isamu Morisako, Kazutoshi Ueda
Publikováno v:
2019 IEEE International Workshop on Integrated Power Packaging (IWIPP).
This paper reports on evaluation of inverter system using silicon carbide (SiC) power module with a novel packaging technology of Ni micro plating bonding. The power module is developed to make the structure maximize the performance of SiC attracting
Autor:
Kohei Tatsumi, Minoru Fukumori, Yasunori Tanaka, Yoon Jeongbin, Keiko Wada, Tomonori Iizuka, Norihiro Murakawa, Isamu Morisako
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
Recently there are high expectations for incorporating silicon carbide (SiC) devices as power modules in hybrid electric vehicles (HEV) and electric vehicles (EV). The need for new bonding technologies, which can deliver high-temperature thermal resi
Publikováno v:
IEEJ Transactions on Sensors and Micromachines. 138:327-328
Publikováno v:
The Proceedings of the Bioengineering Conference Annual Meeting of BED/JSME. :75-76
Publikováno v:
The Proceedings of the Symposium on Micro-Nano Science and Technology. :17-18