Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Irena Stalnioniene"'
Autor:
Loreta Tamasauskaite-Tamasiunaite, Jurate Vaiciuniene, Algirdas Selskis, Albina Zieliene, Birute Simkunaite-Stanyniene, Miroslav Semasko, Irena Stalnioniene, Eugenijus Norkus
Publikováno v:
ECS Transactions. 68:37-44
In this study the graphene supported PtRuCo catalysts were prepared with different Pt:Ru:Co molar ratios equal to 3.5:1:23, 1:1.7:5.6 and 1:2:2 by means of microwave synthesis. The shape and size of catalyst particles were examined using a Transmissi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::76635f2c33fd365288338543e7213aa6
https://doi.org/10.1149/06803.0037ecst
https://doi.org/10.1149/06803.0037ecst
Publikováno v:
ECS Meeting Abstracts. :791-791
The industrial electroless copper plating solutions containing formaldehyde as reducing agent are known from the middle of the last century and are widespread in the practice up to now. They are widely used in electronics for deposition of metallic c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97ac963759f8fa6059eb88f59aef2c08
https://doi.org/10.1149/ma2018-02/21/791
https://doi.org/10.1149/ma2018-02/21/791
Autor:
Eugenijus Norkus, Kestutis Prusinskas, Jane Jaciauskiene, Donald L. Macalady, Irena Stalnioniene, Algirdas Vaškelis
Publikováno v:
Carbohydrate Research. 342:71-78
Saccharose, forming sufficiently stable complexes with copper(II) ions in alkaline solutions, was found to be a suitable ligand for copper(II) chelating in alkaline (pH > 12) electroless copper deposition solutions. Reduction of copper(II)–saccharo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fcfeab9f9c0744875db8728d7892cd03
https://doi.org/10.1016/j.carres.2006.10.020
https://doi.org/10.1016/j.carres.2006.10.020
Publikováno v:
Electrochimica Acta. 49:1613-1621
The anodic oxidation of formaldehyde on Cu surfaces deposited by electroplating and electroless plating was investigated by using cyclic voltammetry; Cu surface area (nano-scale roughness factor R n ) was determined using underpotential thallium mono
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8c26e1dbbcf07304656bd25fc99dadd2
https://doi.org/10.1016/j.electacta.2003.11.023
https://doi.org/10.1016/j.electacta.2003.11.023
Publikováno v:
Journal of Solid State Electrochemistry. 4:337-341
The surface area (nanoscale roughness) of copper coatings deposited from electroless plating solutions containing Quadrol, L(+)- and DL(∓)-tartrate as Cu(II) ion ligands was measured using underpotential deposition thallium monolayer formation. Sur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d4af7552d2d655e3d7d55d0b1e355ec
https://doi.org/10.1007/s100080000129
https://doi.org/10.1007/s100080000129
Autor:
Miroslav Semasko, Loreta Tamasauskaite-Tamasiunaite, Irena Stalnioniene, Albina Zieliene, Jurate Vaiciuniene, Birute Simkunaite-Stanyniene, Algirdas Selskis, Eugenijus Norkus
Publikováno v:
ECS Meeting Abstracts. :625-625
Sodium borohydride is of interest as a source for a hydrogen generation during its catalytic hydrolysis. Various catalysts have been developed for this purpose. In the present study the graphene supported platinum-ruthenium-cobalt catalysts (denoted
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38bee4ce45a97d1c350c46535b81f050
https://doi.org/10.1149/ma2015-03/3/625
https://doi.org/10.1149/ma2015-03/3/625
Autor:
Eugenijus Norkus, Aldona Balciunaite, Svetlana Lichusina, Dijana Simkunaite, Irena Stalnioniene, Albina Zieliene, Jurate Vaiciuniene, Algirdas Selskis, Loreta Tamasauskaite-Tamasiunaite
Publikováno v:
ECS Meeting Abstracts. :1174-1174
Among chemical hydrides sodium borohydride is widely used as a source for a hydrogen generation during its catalytic hydrolysis. This attention is determined by its features such as a high hydrogen storage capacity, nontoxicity, good storability, eas
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d13ea5390abfcfde4989bc34afd9b9f6
https://doi.org/10.1149/ma2014-02/21/1174
https://doi.org/10.1149/ma2014-02/21/1174
Publikováno v:
ECS Meeting Abstracts. :521-521
Cu(II) ligands are important components of common formaldehyde-containing alkaline electroless copper plating baths: Cu(II)-Ligand + 2CH2O(hydrated) + 4OH- → Cu + 2HCOO- + H2 + 2H2O + Ligand (1) From one hand, the ligands used should form Cu(II) co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d54795691282863680218aef1777518
https://doi.org/10.1149/ma2014-01/9/521
https://doi.org/10.1149/ma2014-01/9/521