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pro vyhledávání: '"Iqbal, Md Arif"'
Publikováno v:
Social Responsibility Journal, 2023, Vol. 19, Issue 9, pp. 1654-1670.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SRJ-01-2022-0035
Autor:
Iqbal, Md Arif, Sapireddy, Srinivas Rahul, Dasari, Sumanth, Asifuzzaman, Kazi, Rahman, Mostafizur
Publikováno v:
In Memories - Materials, Devices, Circuits and Systems April 2024 7
Autor:
Macha, Naveen Kumar, Iqbal, Md Arif, Repalle, Bhavana Tejaswini, Hossain, Sehtab, Rahman, Mostafizur
The past few decades have seen exponential growth in capabilities of digital electronics primarily due to the ability to scale Integrated Circuits (ICs) to smaller dimensions while attaining power and performance benefits. That scalability is now bei
Externí odkaz:
http://arxiv.org/abs/2004.08040
Crosstalk computing, involving engineered interference between nanoscale metal lines, offers a fresh perspective to scaling through co-existence with CMOS. Through capacitive manipulations and innovative circuit style, not only primitive gates can be
Externí odkaz:
http://arxiv.org/abs/1904.03294
Autor:
Macha, Naveen Kumar, Geedipally, Sandeep, Repalle, Bhavana, Iqbal, Md Arif, Danesh, Wafi, Rahman, Mostafizur
Truly polymorphic circuits, whose functionality/circuit behavior can be altered using a control variable, can provide tremendous benefits in multi-functional system design and resource sharing. For secure and fault tolerant hardware designs these can
Externí odkaz:
http://arxiv.org/abs/1807.01431
For beyond 2-D CMOS logic, various 3-D integration approaches specially transistor based 3-D integrations such as monolithic 3-D [1], Skybridge [2], SN3D [3] holds most promise. However, such 3D architectures within small form factor increase hotspot
Externí odkaz:
http://arxiv.org/abs/1803.03727
Publikováno v:
In Integration May 2022 84:62-71
Publikováno v:
Journal of Fashion Marketing & Management; 2024, Vol. 28 Issue 4, p653-671, 19p
Publikováno v:
In Microelectronics Journal September 2019 91:61-69
Akademický článek
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