Zobrazeno 1 - 10
of 66
pro vyhledávání: '"Ioan Plotog"'
Publikováno v:
INCAS Bulletin, Vol 8, Iss 1, Pp 131-138 (2016)
The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of
Externí odkaz:
https://doaj.org/article/052e720d53914040ad41c1f1306b37a5
Publikováno v:
2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME).
The paper presents the investigations of bonds mechanical and electrical properties function of electrically conductive paste printed volumes. For the experiments, it was taken into consideration the SW180 electrically conductive paste type which was
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55c943cf589487b38d74e254ffc79834
https://doi.org/10.1109/siitme47687.2019.8990829
https://doi.org/10.1109/siitme47687.2019.8990829
Autor:
Marian Vladescu, Gaudentiu Varzaru, Bogdan Mihailescu, Mihai Branzei, Ioan Plotog, Paul Svasta
Publikováno v:
2019 42nd International Spring Seminar on Electronics Technology (ISSE).
Solderless assembly for electronics is a subject approached ever since RoHS EU Directive enforced lead-free technology especially since this one has revealed its limits. Electrically Conductive Adhesives (ECA) actually with a large commercial offer b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::003a1b22668ee2089d209f0172b22376
https://doi.org/10.1109/isse.2019.8810294
https://doi.org/10.1109/isse.2019.8810294
Publikováno v:
Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies IX.
The SW150 and the new types SW180 of Electrically Conductive Adhesives (ECA) dedicated to printing circuits1, meeting RoHS EU Directive2, were used, according to REACH EU Regulation3, to bond optoelectronics components, LED type, on test printed circ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::80c482482526640eea93f926dc92b4b8
https://doi.org/10.1117/12.2326206
https://doi.org/10.1117/12.2326206
Publikováno v:
2018 41st International Spring Seminar on Electronics Technology (ISSE).
The paper presents the mechanical and electrical properties of the joints as function of curing temperatures. These are made by printing a SW180 type ECAP (Electrically Conductive Adhesives Pastes) on printed circuit boards (PCBs) having daisy chain
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47f3d7ed64ee7f9046d8f60bf91e4ce3
https://doi.org/10.1109/isse.2018.8443656
https://doi.org/10.1109/isse.2018.8443656
Autor:
Ioan Plotog, Mihai Branzei
Publikováno v:
Advanced Materials Research. 1114:172-179
The electronic modules are complex ensemble of electronic components having terminals (PIN) connected by solder joints on dedicated metallic surfaces (PAD) parts of conductive interconnection structure realized on rigid or flexible dielectric substra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1aa4a87c6103dcf602d5c89be93fa2cb
https://doi.org/10.4028/www.scientific.net/amr.1114.172
https://doi.org/10.4028/www.scientific.net/amr.1114.172
Publikováno v:
Key Engineering Materials. 638:141-144
The need for reliable data on thermophysical properties of materials has increased continuously in the last period. The existing data, except for some pure elements or alloys and compounds, often unreliable, and in many cases the need for accurate an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b0dbc1ed52c3bd2adb8691ab3aae91a3
https://doi.org/10.4028/www.scientific.net/kem.638.141
https://doi.org/10.4028/www.scientific.net/kem.638.141
Publikováno v:
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME).
Under the current conditions of reducing manufacturing costs and complying with the RoHS 2 EU Recast Directive in the automotive industry, without compromising functionality and reliability, it has become necessary to create a new Lead-Free Solder Pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e70c4a0b5d008385190bb2b9db203ec2
https://doi.org/10.1109/siitme.2017.8259861
https://doi.org/10.1109/siitme.2017.8259861
Publikováno v:
2017 9th International Conference on Electronics, Computers and Artificial Intelligence (ECAI).
Generally, remote control of electric motors consists in commands for operation using two main methods, wireless and wired. Wired remote control implies a dedicated path for low voltage signals separated from the power line. The increased cost of cop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1be8a807318ea611887a89362a06e3e0
https://doi.org/10.1109/ecai.2017.8166467
https://doi.org/10.1109/ecai.2017.8166467
Comparative shear tests of two low melting point solder pastes relating to their thermal diffusivity
Publikováno v:
2017 40th International Spring Seminar on Electronics Technology (ISSE).
In a vehicle, for electronic components, the working temperature may vary between the limits 358K and 478K. The manufacturing costs reduction necessity combined with the RoHS2 EU Directive consequence lead to create new Low Melting Point Lead-Free (L
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78c75a8d5888461d90a9d91a6af4a3c6
https://doi.org/10.1109/isse.2017.8000937
https://doi.org/10.1109/isse.2017.8000937