Zobrazeno 1 - 10
of 9 286
pro vyhledávání: '"Intermetallic compound"'
Publikováno v:
Soldering & Surface Mount Technology, 2024, Vol. 36, Issue 5, pp. 285-295.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/SSMT-02-2024-0007
Publikováno v:
Journal of Materials Research and Technology, Vol 33, Iss , Pp 7274-7283 (2024)
Sn–Bi solder, considered to be a lead-free solder that can be used in the packaging of heat-sensitive devices, has been attracting increasing attention from researchers due to its excellent mechanical properties. The microstructure evolution, inter
Externí odkaz:
https://doaj.org/article/e9f31c9de14441baaca19ac6c326432a
Publikováno v:
Journal of Materials Research and Technology, Vol 33, Iss , Pp 6350-6362 (2024)
This paper investigates the corrosion behavior of Fe-SG series metals with different graphite nodule counts to molten Al by using the ultrasonic vibration hot-dip aluminum experimental method. Fe-SG series metals to aluminum melt exhibited a much bet
Externí odkaz:
https://doaj.org/article/1866ed2af29c44caba7f17aa8783a5cd
Publikováno v:
Journal of Materials Research and Technology, Vol 33, Iss , Pp 3058-3067 (2024)
High-performance supercars using Li-ion batteries necessitate thicker aluminium busbars with thin steel joints. However, joining these materials often leads to overheating resulting in brittle intermetallic compounds (IMCs), reduced weld quality, and
Externí odkaz:
https://doaj.org/article/13f8381e815f4e69940effe7f3198914
Publikováno v:
Успехи физики металлов, Vol 25, Iss 3, Pp 520-544 (2024)
The alloys of the Ti–Zr–Mn system based on the C14-type Laves phase are considered as ones of the most promising materials for safe storage and transportation of hydrogen. These alloys have appropriate parameters for activating the processes of a
Externí odkaz:
https://doaj.org/article/273611b8d3b34dba970b3921e90f5491
Publikováno v:
Journal of Materials Research and Technology, Vol 32, Iss , Pp 2843-2856 (2024)
Evolution mechanism of interfacial multi-layer intermetallic compounds (IMCs) and their impact on failure behavior in Al–Au wire bonding after thermal storage and thermal cycle process are investigated. Microstructural analysis shows that multi-lay
Externí odkaz:
https://doaj.org/article/e77bcd33aa944efe87be64b1465a9f35
Autor:
Shuai Wang, Jiayun Feng, Wei Wang, Peng Wu, Jiayue Wen, Dongsheng Yang, Yilong Huang, Ruyu Tian, Shang Wang, Yanhong Tian
Publikováno v:
Journal of Materials Research and Technology, Vol 32, Iss , Pp 937-954 (2024)
Cu pillar bump (CPB) technology as the representative advanced packaging technology possesses the characteristics of miniaturization and high density, thus playing an important role in the reliability of electronic devices. However, the brittle inter
Externí odkaz:
https://doaj.org/article/950bfd36b4824269b54d45ca39a69093
Publikováno v:
Journal of Materials Research and Technology, Vol 31, Iss , Pp 3374-3382 (2024)
Due to the demand for high-performance electronic products, there has been a rapid development in three-dimensional integrated circuit (3D IC) packaging technology. The 3D stacking relies on microbumps and through silicon vias (TSVs) to connect multi
Externí odkaz:
https://doaj.org/article/0aa432c6a5bc4e4a9c5df595a412c148
Publikováno v:
Journal of Materials Research and Technology, Vol 31, Iss , Pp 2498-2507 (2024)
The microstructure details of the interface, mechanical properties and failure mechanism of laser welding-brazing (LWB) steel-Al joints with various welding parameters were comparatively investigated. The emergence of ternary Fe–Al–Si intermetall
Externí odkaz:
https://doaj.org/article/1513f024b2ec44ac81a494bc5cf0cc6c
Publikováno v:
Archives of Metallurgy and Materials, Vol vol. 69, Iss No 2, Pp 489-492 (2024)
Effects of Si and Mg as main elements on interface reaction between tool steel and molten Al alloy at 700°C were investigated. Pure aluminum and Al-10mass%Mg alloy showed relatively simple interfacial layers, whereas thicker, multi-layered reaction
Externí odkaz:
https://doaj.org/article/3b062e20792d43008eba407ee9b22817