Microstructure, plasticité et ductilité d'un alliage TNM+ densifié par frittage SPS

Autor: Michael Musi, Christophe Deshayes, Guy Molénat, Louise Toualbi, Benjamin Galy, Petra Spoerk-Erdely, Muriel Hantcherli, Jean-Philippe Monchoux, Marc Thomas, Helmut Clemens, Alain Couret

Publikováno v: Metals
Metals, 2022, 12 (11), pp.1915. ⟨10.3390/met12111915⟩
Metals; Volume 12; Issue 11; Pages: 1915

International audience; This work presents a study of the microstructure and mechanical properties of a TNM+ alloy (Ti-43.5Al-4Nb-1Mo-0.1B-0.3C-0.3Si, in at.%) densified by Spark Plasma Sintering (SPS), in comparison to the as-SPSed TNM alloy, which

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::eac41415eae0e730f4710a44409e5502
https://hal.science/hal-03805151

Optimisation d'un procédé de soudage par difusion à l'état solide pour réaliser des circuits imprimés : Application au système Au-Cu-Sn

Autor: Cornet, Louis

A solid-state diffusion bonding technology, called thermodiffusion, has been developed to miniaturizePCB. A promising configuration where thin layers of gold and tin are coated on the two copper layers to be joined has been chosen. The thermodiffusio

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=od_______166::3b728251fe9e00a8d16a76390a8f3713
https://theses.hal.science/tel-03979031

Discovery of quasicrystals: The early days

Autor: Denis Gratias, Marianne Quiquandon

Publikováno v: Comptes Rendus. Physique
Comptes Rendus. Physique, Académie des sciences (Paris), 2019, 20 (7-8), pp.803-816. ⟨10.1016/j.crhy.2019.05.009⟩

International audience; This paper is a survey of the initial developments of the research on quasicrystals starting from their discovery by Daniel Shechtman (Nobel Prize in Chemistry in 2011) in 1982 at the National Bureau of Standards (now National

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d531e25da87c1687021e478551c85a5a
https://doi.org/10.1016/j.crhy.2019.05.009

Etude des interactions dans le système Cu/SnAg dans le cadre d'assemblages par TLPB des composants électroniques de puissance

Autor: Barik, El Mostafa

Publikováno v: Matériaux. Université Grenoble Alpes [2020-..], 2020. Français. ⟨NNT : 2020GRALI074⟩

Power electronics is continuously developing thanks microelectronics technological advances. Thanks to the emergence of new power devices based on WBG (Wide Band Gap) materials, more powerful electronic systems could be developed. WBG devices, such a

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::df5afa65862b57eb440e9fa705e32aee
https://tel.archives-ouvertes.fr/tel-03166640

On the surface structures and catalytic properties of Al-based intermetallics

Autor: Chatelier, Corentin

Publikováno v: Materials Science [cond-mat.mtrl-sci]. Université de Lorraine, 2020. English. ⟨NNT : 2020LORR0230⟩

Replacing noble metal (Pd, Pt, Au) catalysts with inexpensive, environmentally harmless, active, selective, and stable substitutes is a big challenge for the chemical industry. Several aluminium-based complex intermetallic compounds have shown promis

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::0b9cdb6a06416734525d48fb3c202bd2
https://hal.univ-lorraine.fr/tel-03254779