Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Inrak Kim"'
Publikováno v:
Metals and Materials International. 17:631-635
A new method of fabricating Sn bumps by electroplating without a PR (photoresist) mould on a Si die was investigated in terms of the bump growth and morphology for application to 3D-chip stacking. The omission of the PR mould was expected to result i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12029f03b471d8004737e6b2427fe096
https://doi.org/10.1007/s12540-011-0817-5
https://doi.org/10.1007/s12540-011-0817-5
Autor:
Robert Schoenmayr, Guy Matgé, Michele Cappuccio, Piero Petrini, Michael Mayer, J. C. Le Huec, Jacques Sénégas, Xavier Buy, Christian Mazel, Bart Poffyn, M. Szpalski, Milorad Vilendecic, A. Cristini, Ko Kitahara, J. C. Mäurer, M. Melzer, Gilles Perrin, Robert Melcher, Afshin Gangi, Kazuhiro Hasegawa, Frank Kandziora, Stefano Bandiera, Gwen Sys, Inrak Kim, Alessandro Gasbarrini, A. Bourghli, Stéphane Aunoble, Stefano Boriani, Giancarlo Guizzardi, L. Darko, Gilles Dubois, Kazuya Minato-ku Oribe, Paul Friedhelm Heini, L. Balabaud, B. De Germay, Hans Ekkehart Vitzthum, B. Salmon, Dirk Uyttendaele, T. Parlevliet, M. Chalali, Marek Szpalski, Georgia Tsoumakidou, Takeshi Fuji, M. Scholsem, Denis L. Kaech, Noboru Hosono
Publikováno v:
ArgoSpine News & Journal. 22:12-42
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fa4d59a5b2af340f91719a55b21dc427
https://doi.org/10.1007/s12240-010-0005-3
https://doi.org/10.1007/s12240-010-0005-3
Publikováno v:
MATERIALS TRANSACTIONS. 51:1887-1892
A new bumping process on a Si die by electroplating without a photo-resist-mold (PRM) was assessed for the three dimensional (3D) stacking of Si dice. In this process, solder bumps were deposited selectively onto the surface of a Cu plugged-through s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::beab09aaafd05e64ea18937040b0dc8a
https://doi.org/10.2320/matertrans.m2009314
https://doi.org/10.2320/matertrans.m2009314