Zobrazeno 1 - 10
of 21
pro vyhledávání: '"Inkwon Ju"'
Publikováno v:
2022 27th Asia Pacific Conference on Communications (APCC).
Publikováno v:
The Journal of Korean Institute of Electromagnetic Engineering and Science. 25:504-514
An MMIC multi-function chip with a low DC power consumption for an X-band active phased array radar system has been designed and fabricated using a 0.5 GaAs p-HEMT commercial process. The multi-function chip provides several functions: 6-bit phase sh
Publikováno v:
ETRI Journal. 35:378-385
An S-band multifunction chip with a simple interface for an active phased array base station antenna for nextgeneration mobile communications is designed and fabricated using commercial 0.5-μm GaAs pHEMT technology. To reduce the cost of the module
Publikováno v:
The Journal of Korean Institute of Electromagnetic Engineering and Science. 22:613-624
An MMIC multi-function chip for an X-band active phased array radar system has been designed and fabricated using a 0.5 GaAs p-HEMT commercial process. A digital serial-to-parallel converter is included in this chip in order to reduce the number of t
Publikováno v:
Microwave and Optical Technology Letters. 50:24-29
The new vertical transition using the trough line, the slab line, and shielded multilayer coplanar waveguides (SMCPW) in order to implement the DC ∼ 50-GHz band low loss LTCC hermetic surface mounting (SMT) MMIC package was developed. The trough li
Publikováno v:
2015 Conference on Microwave Techniques (COMITE).
In this paper, we present the GaAs PHEMT monolithic microwave integrated circuit (MMIC) high-power amplifier (HPA) with high efficiency and broadband. The HPA delivers 36 ∼ 37dBm (4∼5W) saturated output power with 28 ∼ 31% power added efficienc
Publikováno v:
2013 Asia-Pacific Microwave Conference Proceedings (APMC).
This paper describes methods of supporting efficiency of an HPA at K band. We designed and fabricated HPA MMIC for K band using UMS 0.25 um GaAs process and then added adaptive biasing circuits for preservation of HPA efficiency. The circuits for mai
Publikováno v:
2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems.
A surface mounting (SMT) low temperature cofired ceramic (LTCC) MMIC package was developed using new vertical transition consist of a trough line, a slab line, and shielded multilayer coplanar waveguides (SMCPWs) for DC to 50 GHz band applications. A
Publikováno v:
2008 38th European Microwave Conference.
High performance vertical transition from DC to 70 GHz was proposed for system-on-package (SoP) applications. The trough line, slab line and shielded multilayer coplanar waveguides were employed to minimize the radiation loss, crosstalk and discontin
Publikováno v:
25th AIAA International Communications Satellite Systems Conference (organized by APSCC).
[Abstract] This paper presents the design and test results of the Qualification Model 4x4 Microwave Switch Matrix (MSM) using PIN diode switches for the Communication, Oceanographic, and Meteorological Satellite (COMS) Ka-band communication payload.