Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Ingram Borg"'
Autor:
Edward Gatt, Joseph Micallef, Roseanne Duca, Russell Farrugia, Ingram Borg, Ivan Grech, Ivan Ellul, Owen Casha
Publikováno v:
Microsystem Technologies. 23:4025-4034
Advanced 3D MEMS packaging technologies involving the encapsulation of devices at wafer-level are being developed in order to achieve further minimization and cost reduction of consumer electronic devices. Compression molding using epoxy molding comp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2621bc4c633551d2f4a0b3d563fdf8c8
https://doi.org/10.1007/s00542-015-2773-3
https://doi.org/10.1007/s00542-015-2773-3
Autor:
Edward Gatt, Owen Casha, Joseph Micallef, Ivan Grech, Roseanne Duca, Ingram Borg, Russell Farrugia, Ivan Ellul
Publikováno v:
2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).
Novel 3D packaging technologies which require largearea mold embedding are being developed in order to achieve further minimization and cost reductions. Compression molding using epoxy molding compounds is one technique being considered for wafer-lev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4984e901a916621b80b6f65def636294
https://doi.org/10.1109/dtip.2015.7161031
https://doi.org/10.1109/dtip.2015.7161031