Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Ingo Herrmann"'
Autor:
Nicola Massari, Alessandro Tontini, Luca Parmesan, Matteo Perenzoni, Milos Gruijc, Ingrid Verbauwhede, Thomas Strohm, Dayo Oshinubi, Ingo Herrmann, Andreas Brenneis
Publikováno v:
ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC).
ispartof: pages:73-76 ispartof: ESSCIRC 2022- IEEE 48TH EUROPEAN SOLID STATE CIRCUITS CONFERENCE (ESSCIRC) pages:73-76 ispartof: 48th IEEE European Solid State Circuits Conference (ESSCIRC) location:ITALY, Milan date:19 Sep - 22 Sep 2022 status: publ
Autor:
Nicola Massari, Yu Zou, Manuel Moreno Garcia, Luca Parmesan, Alessandro Tontini, Sonia Mazzucchi, Nicolo` Leone, Stefano Azzini, Lorenzo Pavesi, Ingo Herrmann, Thomas Strohm
Publikováno v:
Quantum Technologies 2022.
Publikováno v:
Laryngo- rhino- otologie. 95(5)
Autor:
David Borowsky, Ingo Herrmann, Christoph Schelling, Shen Hue Sun, Daniel B. Etter, Franz Xaver Hutter, Joachim N. Burghartz, Fabian Utermohlen
Publikováno v:
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS).
We present a scalable low-cost microbolometer technology platform which is based on separate fabrication of MEMS and read-out ASIC CMOS wafers. Mechanical, electrical and hermetical connection is achieved by Cu-based thermocompression bonding. The pe
Publikováno v:
2013 International Semiconductor Conference Dresden - Grenoble (ISCDG).
A model for the electrical behavior of pn-junction diodes biased in forward direction and used as a temperature sensitive device (TSD) in microbolometers is presented. It is based on the well-known Shockley equation extended by the ideality factor m.
Autor:
Shen Hue Sun, Ingo Herrmann, Joachim N. Burghartz, Daniel B. Etter, Franz Xaver Hutter, Fabian Utermohlen
Publikováno v:
2013 International Semiconductor Conference Dresden - Grenoble (ISCDG).
A fabrication process for a thermo-diode microbolometer array is presented. The process is based on a sintered porous silicon (sPS) technique adopted from Chipfilm™ technology to enable vertical thermal insulation of the pixels. In addition, the pr
Autor:
Christian Rettig, Dayo Oshinubi, Karl-Franz Reinhart, Tjalf Pirk, Edda Sommer, Ingo Herrmann, Mirko Hattass
Publikováno v:
Advanced Microsystems for Automotive Applications 2011 ISBN: 9783642213809
In the EU FP7 project "ADOSE" a new approach has been used to develop a new cost efficient technology by adapting a volume proven integrated MEMS process for the production of a suspended thermodiode array. As low-cost was to be the key feature of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59e26d8bb0e012d39474978155588e3a
https://doi.org/10.1007/978-3-642-21381-6_9
https://doi.org/10.1007/978-3-642-21381-6_9
Publikováno v:
Advanced Microsystems for Automotive Applications 2009 ISBN: 9783642007446
Sensor data fusion of active near infrared (NIR) and passive far infrared (FIR) for reliable detection of vulnerable road users in future warning automotive night vision systems requires for low-cost, mid-resolution FIR sensor arrays for hot spot det
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1001f1e479ef710c5ea4ad63331f1017
https://doi.org/10.1007/978-3-642-00745-3_26
https://doi.org/10.1007/978-3-642-00745-3_26
Autor:
Ingo Herrmann, Martin Eckardt, F. Freund, Dayo Oshinubi, Edda Sommer, Volker Krüger, U. Kunz, Ando Feyh, K.-F. Reinhart, Tjalf Pirk
Publikováno v:
Procedia Engineering
A new low-cost process for mid resolution FIR-Arrays for thermal imaging in the LWIR range (8- 14 μm) has been developed. Integrated array devices with 1k and 5k pixel array size have been designed and manufactured using this process which is fully