Zobrazeno 1 - 10
of 121
pro vyhledávání: '"Indranath Dutta"'
Publikováno v:
Journal of Electronic Materials. 49:3367-3382
Thin Sn-based solder microjoints, typically less than 25 μm thick, attached to Cu bond pads on both sides in three-dimensional electronic packages are often converted completely into intermetallic compounds (IMC) during service or accelerated testin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4f0d98f70e38adc50025eaf5526d87f
https://doi.org/10.1007/s11664-020-08019-8
https://doi.org/10.1007/s11664-020-08019-8
Publikováno v:
JOM. 72:906-917
Tin whiskers pose an electrical reliability risk in the form of potential short circuits. This problem was solved in the past by adding a few percent of Pb during Sn electroplating, but with the ban on Pb in Europe and elsewhere, it has resurfaced. W
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b6be56ac196979e03df01cf4729402b
https://doi.org/10.1007/s11837-019-03933-7
https://doi.org/10.1007/s11837-019-03933-7
Publikováno v:
3D Microelectronic Packaging ISBN: 9789811570896
The copper pumping problem exemplifies the complex reliability issues still to be resolved for TSV structures. From a materials science perspective the reliability issues presented by TSVs are linked to manufacturing processes and the resultant micro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::adc4f8922be4e7f073a840fdf446dffd
https://doi.org/10.1007/978-981-15-7090-2_4
https://doi.org/10.1007/978-981-15-7090-2_4
Publikováno v:
Journal of Electronic Materials. 48:159-169
In three-dimensional stacked-die packages, through-silicon vias (TSVs) are used to connect multiple adjacent dies through solder micro-bumps. During thermal cycling, the thermal expansion mismatch between the copper TSVs and the silicon dies creates
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fe1a6e20533ae1bd895bf7b4fc5b61d
https://doi.org/10.1007/s11664-018-6805-5
https://doi.org/10.1007/s11664-018-6805-5
Publikováno v:
Journal of Electronic Materials. 47:6229-6240
The effect of indium doping on whisker mitigation in tin electroplated on copper has been investigated. Whisker growth studies show that indium addition to Sn effectively mitigates whisker growth. Cross-section images showed predominantly columnar gr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5335c542f4cdd3758a163dcb1539b66
https://doi.org/10.1007/s11664-018-6522-0
https://doi.org/10.1007/s11664-018-6522-0
Autor:
P. Ajay Kumar, Indranath Dutta
Publikováno v:
Journal of Electronic Materials. 47:5488-5497
In 3D electronic packages, stacked dies are connected vertically using through-silicon vias and solder micro-bumps, which are typically between 1 μm and 50 μm thick. Solder micro-joints undergo significant shear deformation due to various loading c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9edfbbf282f6ccbb7e32d9ca5a064fa
https://doi.org/10.1007/s11664-018-6434-z
https://doi.org/10.1007/s11664-018-6434-z
Autor:
Indranath Dutta, S. Das Mahapatra
Publikováno v:
Surface and Coatings Technology. 337:478-483
The growth of whiskers on tin-plated interconnects causes acute short circuit problems and system failures in electronic components. In the past, this problem was suppressed by the addition of a few percent Pb in the electroplated tin, but following
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cb21fdbad95979876e7d178f5b34e397
https://doi.org/10.1016/j.surfcoat.2018.01.061
https://doi.org/10.1016/j.surfcoat.2018.01.061
Publikováno v:
Journal of The Electrochemical Society. 165:D816-D824
Electroplated tin films are important for several technologies such as microelectronics, Li-ion batteries, and corrosion-resistant coatings. In this paper, we demonstrate that the microstructure of tin films can be precisely controlled by addition of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe18245e97abbd4ceef1f7cd99d3f064
https://doi.org/10.1149/2.0801816jes
https://doi.org/10.1149/2.0801816jes
Autor:
Indranath Dutta, S. Das Mahapatra
Publikováno v:
Materials Science and Engineering: A. 706:181-191
The growth of tin whiskers on fine pitched Sn-plated interconnect lines poses catastrophic short circuit problems in electronic components, especially those with long service lives like in space, defense and transportation industries. In the past, th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae7d576fbd6ba675bc2a957f597b8a8b
https://doi.org/10.1016/j.msea.2017.09.006
https://doi.org/10.1016/j.msea.2017.09.006
Publikováno v:
Journal of Electronic Materials. 46:4062-4075
Whisker growth from Sn coatings is a reliability concern in electronic packages, until recently mitigated by Pb addition. Recently, it was demonstrated that doping with In dramatically reduces whisker growth in 1 μm thick Sn. Here, we present the re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84a4b00eff04bd1ad98e65da40a35ee0
https://doi.org/10.1007/s11664-016-5177-y
https://doi.org/10.1007/s11664-016-5177-y