Výsledky vyhledávání - "Inamura, Miki"

Akademický článek

Vacuum sealing using surface activation bonding of Si wafer

Autor: Inamura, Miki, Yoshida, Noriko, Oda, Tomohiro, Abe, Tomoyuki, Abe, Hideyuki, Kusunoki, Isao

Publikováno v: In Vacuum 2009 84(5):518-522

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Conference

III–V/Si Chip-on-Wafer Direct Transfer Bonding technology (CoW DTB); process capabilities and bonded structure characterizations.

Autor: Kurita, Yoichiro, Uemura, Hiroshi, Ishibashi, Fumitaka, Furuyama, Hideto, Inamura, Miki, Kakumoto, Yasuhide, Abe, Tomoyuki

Publikováno v: 2016 6th Electronic System-Integration Technology Conference (ESTC); 2016, p1-6, 6p

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Conference

A novel III-V/Si Chip-on-Wafer Direct Transfer Bonding technology.

Autor: Kurita, Yoichiro, Inamura, Miki, Kakumoto, Yasuhide, Yamada, Yasuhisa, Abe, Tomoyuki

Publikováno v: 2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC); 1/1/2015, p1-6, 6p

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