Zobrazeno 1 - 2
of 2
pro vyhledávání: '"InSu Mok"'
Autor:
GyuIck Jung, SooHyun Kim, HoDol Yoo, WonChul Do, TaeKyeong Hwang, WonMyoung Ki, JaeHun Bae, InSu Mok, SeungMan Ryu
Publikováno v:
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density Fan-Out (HDFO) test vehicles using a wafer-level compression molding process. The redistribution
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::57f86d541912049fab1dc55bb89e4dc6
https://doi.org/10.1109/eptc50525.2020.9315128
https://doi.org/10.1109/eptc50525.2020.9315128
Autor:
InSu Mok, Curtis Zwenger, Moh Kolbehdari, IlBok Lee, Alex Copia, WonChul Do, Kang-Wook Lee, Wongeol Lee, Suresh Jayaraman, WonMyoung Ki
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Fan-out wafer level packaging (FOWLP) is one of the latest technologies to meet the requirements of high performance and thin form-factor, especially for mobile application processors. To achieve a simple path way and thinner package form, many outso
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9ba204afcca55ef029be9dab43a68c11
https://doi.org/10.1109/ectc.2018.00092
https://doi.org/10.1109/ectc.2018.00092